DLPS153 October   2023 DLP651LE

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  System Mounting Interface Loads
    9. 6.9  Micromirror Array Physical Characteristics
    10. 6.10 Micromirror Array Optical Characteristics
    11. 6.11 Window Characteristics
    12. 6.12 Chipset Component Usage Specification
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Optical Interface and System Image Quality Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill
    5. 7.5 Micromirror Array Temperature Calculation
    6. 7.6 Micromirror Power Density Calculation
    7. 7.7 Window Aperture Illumination Overfill Calculation
    8. 7.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
      1. 9.2.1 Layers
      2. 9.2.2 Impedance Requirements
      3. 9.2.3 Trace Width, Spacing
  11. 10Power Supply Recommendations
    1. 10.1 DMD Power Supply Power-Up Procedure
    2. 10.2 DMD Power Supply Power-Down Procedure
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • FYM|149
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 Window Aperture Illumination Overfill Calculation

The amount of optical overfill on the critical area of the window aperture cannot be measured directly. For systems with uniform illumination on the array the amount is determined using the total measured incident optical power on the DMD, and the ratio of the total optical power on the DMD that is on the defined critical area. The optical model is used to determine the percent of optical power on the window aperture critical area and estimate the size of the area.

  • QAP-ILL = [QINCIDENT × OPAP_ILL_RATIO] ÷ AAP_ILL (W/cm2)

where:

  • QAP-ILL = window aperture illumination overfill (W/cm2)
  • QINCIDENT = total incident optical power on the DMD (Watts) (measured)
  • OPAP_ILL_RATIO = ratio of the optical power on the critical area of the window aperture to the total optical power on the DMD (optical model)
  • AAP-ILL = size of the window aperture critical area (cm2) (datasheet)
  • OPCA_RATIO = percent of the window aperture critical area with incident optical power (%) (optical model)

Sample calculation:

GUID-2EDE8A48-57D7-4EB2-A1B0-C9D9BDFEE02D-low.pngFigure 7-2 Window Aperture Overfill Example

See the figure for the length of the critical aperture.

Equation 18. QINCIDENT = 45 W (measured)
Equation 19. OPAP_ILL_RATIO = 0.312% (optical model)
Equation 20. OVCA_RATIO = 25% (optical model)
Equation 21. Length of the window aperture for critical area = 0.9997 (data sheet)
Equation 22. Width of critical area = 0.050 cm (data sheet)
Equation 23. AAP-ILL = 0.99977 cm × 0.050 cm = 0.049989 (cm2)
Equation 24. QAP-ILL = (45 × 0.00312) ÷ (0.049989 × 0.25) = 11.2 (W/cm2)