DLPS280 October   2024 DLPA3082

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 SPI Timing Parameters
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Description
    3. 6.3 Feature Description
      1. 6.3.1 Supply and Monitoring
        1. 6.3.1.1 Supply
        2. 6.3.1.2 Monitoring
          1. 6.3.1.2.1 Block Faults
          2. 6.3.1.2.2 Thermal Protection
      2. 6.3.2 DMD Supplies
        1. 6.3.2.1 LDO DMD
        2. 6.3.2.2 DMD HV Regulator
        3. 6.3.2.3 DMD/DLPC Buck Converters
        4. 6.3.2.4 DMD Monitoring
          1. 6.3.2.4.1 Power Good
          2. 6.3.2.4.2 Overvoltage Fault
      3. 6.3.3 Buck Converters
        1. 6.3.3.1 LDO Bucks
        2. 6.3.3.2 General Purpose Buck Converters
        3. 6.3.3.3 Buck Converter Monitoring
          1. 6.3.3.3.1 Power Good
          2. 6.3.3.3.2 Overvoltage Fault
        4. 6.3.3.4 Buck Converter Efficiency
      4. 6.3.4 Auxiliary LDOs
      5. 6.3.5 Measurement System
    4. 6.4 Device Functional Modes
    5. 6.5 Programming
      1. 6.5.1 SPI
      2. 6.5.2 Interrupt
      3. 6.5.3 Fast-Shutdown in Case of Fault
    6. 6.6 Register Maps
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Component Selection for General-Purpose Buck Converter
    3. 7.3 System Example with DLPA3082 Internal Block Diagram
    4. 7.4 Power Supply Recommendations
      1. 7.4.1 Power-Up and Power-Down Timing
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
        1. 7.5.1.1 SPI Connections
      2. 7.5.2 Layout Example
      3. 7.5.3 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 Device Support
      1. 8.2.1 Device Nomenclature
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
6.3.1.2.2 Thermal Protection

The chip temperature is monitored constantly to prevent overheating of the device. There are two levels of a fault condition. The first is TS_WARN (0x0C, bit 0) to warn of overheating. This is an indication that the chip temperature rises to a critical temperature. The next level of warning is TS_SHUT (0x0C, bit 1). This occurs at a higher temperature than TS_WARN (0x0C, bit 0) and shuts down the chip to prevent permanent damage. Both temperature faults have hysteresis on each level to prevent rapid switching around the temperature threshold.