SNLS504E October   2015  â€“ May 2024 DP83867CS , DP83867E , DP83867IS

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
    1. 5.1 Pin Functions
    2. 5.2 Unused Pins
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Power-Up Timing
    7. 6.7  Reset Timing
    8. 6.8  MII Serial Management Timing
    9. 6.9  SGMII Timing
    10. 6.10 RGMII Timing
    11. 6.11 DP83867E Start of Frame Detection Timing
    12. 6.12 DP83867IS/CS Start of Frame Detection Timing
    13. 6.13 Timing Diagrams
    14. 6.14 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 WoL (Wake-on-LAN) Packet Detection
        1. 7.3.1.1 Magic Packet Structure
        2. 7.3.1.2 Magic Packet Example
        3. 7.3.1.3 Wake-on-LAN Configuration and Status
      2. 7.3.2 Start of Frame Detect for IEEE 1588 Time Stamp
        1. 7.3.2.1 SFD Latency Variation and Determinism
          1. 7.3.2.1.1 1000Mb SFD Variation in Master Mode
          2. 7.3.2.1.2 1000Mb SFD Variation in Slave Mode
          3. 7.3.2.1.3 100Mb SFD Variation
      3. 7.3.3 Clock Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 MAC Interfaces
        1. 7.4.1.1 Serial GMII (SGMII)
        2. 7.4.1.2 Reduced GMII (RGMII)
          1. 7.4.1.2.1 1000Mbps Mode Operation
          2. 7.4.1.2.2 1000Mbps Mode Timing
          3. 7.4.1.2.3 10- and 100Mbps Mode
      2. 7.4.2 Serial Management Interface
        1. 7.4.2.1 Extended Address Space Access
          1. 7.4.2.1.1 Write Address Operation
          2. 7.4.2.1.2 Read Address Operation
          3. 7.4.2.1.3 Write (No Post Increment) Operation
          4. 7.4.2.1.4 Read (No Post Increment) Operation
          5. 7.4.2.1.5 Write (Post Increment) Operation
          6. 7.4.2.1.6 Read (Post Increment) Operation
          7. 7.4.2.1.7 Example of Read Operation Using Indirect Register Access
          8. 7.4.2.1.8 Example of Write Operation Using Indirect Register Access
      3. 7.4.3 Auto-Negotiation
        1. 7.4.3.1 Speed and Duplex Selection - Priority Resolution
        2. 7.4.3.2 Master and Slave Resolution
        3. 7.4.3.3 Pause and Asymmetrical Pause Resolution
        4. 7.4.3.4 Next Page Support
        5. 7.4.3.5 Parallel Detection
        6. 7.4.3.6 Restart Auto-Negotiation
        7. 7.4.3.7 Enabling Auto-Negotiation Through Software
        8. 7.4.3.8 Auto-Negotiation Complete Time
        9. 7.4.3.9 Auto-MDIX Resolution
      4. 7.4.4 Loopback Mode
        1. 7.4.4.1 Near-End Loopback
          1. 7.4.4.1.1 MII Loopback
          2. 7.4.4.1.2 PCS Loopback
          3. 7.4.4.1.3 Digital Loopback
          4. 7.4.4.1.4 Analog Loopback
        2. 7.4.4.2 External Loopback
        3. 7.4.4.3 Far-End (Reverse) Loopback
      5. 7.4.5 BIST Configuration
      6. 7.4.6 Cable Diagnostics
        1. 7.4.6.1 TDR
        2. 7.4.6.2 Energy Detect
        3. 7.4.6.3 Fast Link Detect
        4. 7.4.6.4 Speed Optimization
        5. 7.4.6.5 Mirror Mode
        6. 7.4.6.6 Interrupt
        7. 7.4.6.7 IEEE 802.3 Test Modes
    5. 7.5 Programming
      1. 7.5.1 Strap Configuration
      2. 7.5.2 LED Configuration
      3. 7.5.3 LED Operation From 1.8V I/O VDD Supply
      4. 7.5.4 PHY Address Configuration
      5. 7.5.5 Reset Operation
        1. 7.5.5.1 Hardware Reset
        2. 7.5.5.2 IEEE Software Reset
        3. 7.5.5.3 Global Software Reset
        4. 7.5.5.4 Global Software Restart
        5. 7.5.5.5 PCS Restart
      6. 7.5.6 Power-Saving Modes
        1. 7.5.6.1 IEEE Power Down
        2. 7.5.6.2 Deep Power-Down Mode
        3. 7.5.6.3 Active Sleep
        4. 7.5.6.4 Passive Sleep
    6. 7.6 Register Maps
      1. 7.6.1   Basic Mode Control Register (BMCR)
      2. 7.6.2   Basic Mode Status Register (BMSR)
      3. 7.6.3   PHY Identifier Register #1 (PHYIDR1)
      4. 7.6.4   PHY Identifier Register #2 (PHYIDR2)
      5. 7.6.5   Auto-Negotiation Advertisement Register (ANAR)
      6. 7.6.6   Auto-Negotiation Link Partner Ability Register (ANLPAR) (BASE Page)
      7. 7.6.7   Auto-Negotiate Expansion Register (ANER)
      8. 7.6.8   Auto-Negotiation Next Page Transmit Register (ANNPTR)
      9. 7.6.9   Auto-Negotiation Next Page Receive Register (ANNPRR)
      10. 7.6.10  1000BASE-T Configuration Register (CFG1)
      11. 7.6.11  Status Register 1 (STS1)
      12. 7.6.12  Extended Register Addressing
        1. 7.6.12.1 Register Control Register (REGCR)
        2. 7.6.12.2 Address or Data Register (ADDAR)
      13. 7.6.13  1000BASE-T Status Register (1KSCR)
      14. 7.6.14  PHY Control Register (PHYCR)
      15. 7.6.15  PHY Status Register (PHYSTS)
      16. 7.6.16  MII Interrupt Control Register (MICR)
      17. 7.6.17  Interrupt Status Register (ISR)
      18. 7.6.18  Configuration Register 2 (CFG2)
      19. 7.6.19  Receiver Error Counter Register (RECR)
      20. 7.6.20  BIST Control Register (BISCR)
      21. 7.6.21  Status Register 2 (STS2)
      22. 7.6.22  LED Configuration Register 1 (LEDCR1)
      23. 7.6.23  LED Configuration Register 2 (LEDCR2)
      24. 7.6.24  LED Configuration Register (LEDCR3)
      25. 7.6.25  Configuration Register 3 (CFG3)
      26. 7.6.26  Control Register (CTRL)
      27. 7.6.27  Testmode Channel Control (TMCH_CTRL)
      28. 7.6.28  Robust Auto MDIX Timer Configuration Register (AMDIX_TMR_CFG)
      29. 7.6.29  Fast Link Drop Configuration Register (FLD_CFG)
      30. 7.6.30  Fast Link Drop Threshold Configuration Register (FLD_THR_CFG)
      31. 7.6.31  Configuration Register 4 (CFG4)
      32. 7.6.32  RGMII Control Register (RGMIICTL)
      33. 7.6.33  RGMII Control Register 2 (RGMIICTL2)
      34. 7.6.34  SGMII Auto-Negotiation Status (SGMII_ANEG_STS)
      35. 7.6.35  100BASE-TX Configuration (100CR)
      36. 7.6.36  Viterbi Module Configuration (VTM_CFG)
      37. 7.6.37  Skew FIFO Status (SKEW_FIFO)
      38. 7.6.38  Strap Configuration Status Register 1 (STRAP_STS1)
      39. 7.6.39  Strap Configuration Status Register 2 (STRAP_STS2)
      40. 7.6.40  BIST Control and Status Register 1 (BICSR1)
      41. 7.6.41  BIST Control and Status Register 2 (BICSR2)
      42. 7.6.42  BIST Control and Status Register 3 (BICSR3)
      43. 7.6.43  BIST Control and Status Register 4 (BICSR4)
      44. 7.6.44  Configuration for Receiver's Equalizer (CRE)
      45. 7.6.45  RGMII Delay Control Register (RGMIIDCTL)
      46. 7.6.46  ANA_LD_TXG_FINE_GAINSEL_AB (ALTFGAB)
      47. 7.6.47  ANA_LD_TXG_FINE_GAINSEL_CD (ALTFGCD)
      48. 7.6.48  ANA_LD_FILTER_TUNE_AB (ALFTAB)
      49. 7.6.49  ANA_LD_FILTER_TUNE_CD (ALFTCD)
      50. 7.6.50  Configuration of Receiver's LPF (CRLPF)
      51. 7.6.51  Enable Control of Receiver's Equalizer (ECRE)
      52. 7.6.52  PLL Clock-out Control Register (PLLCTL)
      53. 7.6.53  SGMII Control Register 1 (SGMIICTL1)
      54. 7.6.54  Sync FIFO Control (SYNC_FIFO_CTRL)
      55. 7.6.55  Loopback Configuration Register (LOOPCR)
      56. 7.6.56  DSP Configuration (DSP_CONFIG)
      57. 7.6.57  DSP Feedforward Equalizer Configuration (DSP_FFE_CFG)
      58. 7.6.58  Receive Configuration Register (RXFCFG)
      59. 7.6.59  Receive Status Register (RXFSTS)
      60. 7.6.60  Pattern Match Data Register 1 (RXFPMD1)
      61. 7.6.61  Pattern Match Data Register 2 (RXFPMD2)
      62. 7.6.62  Pattern Match Data Register 3 (RXFPMD3)
      63. 7.6.63  SecureOn Pass Register 2 (RXFSOP1)
      64. 7.6.64  SecureOn Pass Register 2 (RXFSOP2)
      65. 7.6.65  SecureOn Pass Register 3 (RXFSOP3)
      66. 7.6.66  Receive Pattern Register 1 (RXFPAT1)
      67. 7.6.67  Receive Pattern Register 2 (RXFPAT2)
      68. 7.6.68  Receive Pattern Register 3 (RXFPAT3)
      69. 7.6.69  Receive Pattern Register 4 (RXFPAT4)
      70. 7.6.70  Receive Pattern Register 5 (RXFPAT5)
      71. 7.6.71  Receive Pattern Register 6 (RXFPAT6)
      72. 7.6.72  Receive Pattern Register 7 (RXFPAT7)
      73. 7.6.73  Receive Pattern Register 8 (RXFPAT8)
      74. 7.6.74  Receive Pattern Register 9 (RXFPAT9)
      75. 7.6.75  Receive Pattern Register 10 (RXFPAT10)
      76. 7.6.76  Receive Pattern Register 11 (RXFPAT11)
      77. 7.6.77  Receive Pattern Register 12 (RXFPAT12)
      78. 7.6.78  Receive Pattern Register 13 (RXFPAT13)
      79. 7.6.79  Receive Pattern Register 14 (RXFPAT14)
      80. 7.6.80  Receive Pattern Register 15 (RXFPAT15)
      81. 7.6.81  Receive Pattern Register 16 (RXFPAT16)
      82. 7.6.82  Receive Pattern Register 17 (RXFPAT17)
      83. 7.6.83  Receive Pattern Register 18 (RXFPAT18)
      84. 7.6.84  Receive Pattern Register 19 (RXFPAT19)
      85. 7.6.85  Receive Pattern Register 20 (RXFPAT20)
      86. 7.6.86  Receive Pattern Register 21 (RXFPAT21)
      87. 7.6.87  Receive Pattern Register 22 (RXFPAT22)
      88. 7.6.88  Receive Pattern Register 23 (RXFPAT23)
      89. 7.6.89  Receive Pattern Register 24 (RXFPAT24)
      90. 7.6.90  Receive Pattern Register 25 (RXFPAT25)
      91. 7.6.91  Receive Pattern Register 26 (RXFPAT26)
      92. 7.6.92  Receive Pattern Register 27 (RXFPAT27)
      93. 7.6.93  Receive Pattern Register 28 (RXFPAT28)
      94. 7.6.94  Receive Pattern Register 29 (RXFPAT29)
      95. 7.6.95  Receive Pattern Register 30 (RXFPAT30)
      96. 7.6.96  Receive Pattern Register 31 (RXFPAT31)
      97. 7.6.97  Receive Pattern Register 32 (RXFPAT32)
      98. 7.6.98  Receive Pattern Byte Mask Register 1 (RXFPBM1)
      99. 7.6.99  Receive Pattern Byte Mask Register 2 (RXFPBM2)
      100. 7.6.100 Receive Pattern Byte Mask Register 3 (RXFPBM3)
      101. 7.6.101 Receive Pattern Byte Mask Register 4 (RXFPBM4)
      102. 7.6.102 Receive Pattern Control (RXFPATC)
      103. 7.6.103 10M SGMII Configuration (10M_SGMII_CFG)
      104. 7.6.104 I/O Configuration (IO_MUX_CFG)
      105. 7.6.105 GPIO Mux Control Register (GPIO_MUX_CTRL)
      106. 7.6.106 TDR General Configuration Register 1 (TDR_GEN_CFG1)
      107. 7.6.107 TDR Peak Locations Register 1 (TDR_PEAKS_LOC_1)
      108. 7.6.108 TDR Peak Locations Register 2 (TDR_PEAKS_LOC_2)
      109. 7.6.109 TDR Peak Locations Register 3 (TDR_PEAKS_LOC_3)
      110. 7.6.110 TDR Peak Locations Register 4 (TDR_PEAKS_LOC_4)
      111. 7.6.111 TDR Peak Locations Register 5 (TDR_PEAKS_LOC_5)
      112. 7.6.112 TDR Peak Locations Register 6 (TDR_PEAKS_LOC_6)
      113. 7.6.113 TDR Peak Locations Register 7 (TDR_PEAKS_LOC_7)
      114. 7.6.114 TDR Peak Locations Register 8 (TDR_PEAKS_LOC_8)
      115. 7.6.115 TDR Peak Locations Register 9 (TDR_PEAKS_LOC_9)
      116. 7.6.116 TDR Peak Locations Register 10 (TDR_PEAKS_LOC_10)
      117. 7.6.117 TDR Peak Amplitudes Register 1 (TDR_PEAKS_AMP_1)
      118. 7.6.118 TDR Peak Amplitudes Register 2 (TDR_PEAKS_AMP_2)
      119. 7.6.119 TDR Peak Amplitudes Register 3 (TDR_PEAKS_AMP_3)
      120. 7.6.120 TDR Peak Amplitudes Register 4 (TDR_PEAKS_AMP_4)
      121. 7.6.121 TDR Peak Amplitudes Register 5 (TDR_PEAKS_AMP_5)
      122. 7.6.122 TDR Peak Amplitudes Register 6 (TDR_PEAKS_AMP_6)
      123. 7.6.123 TDR Peak Amplitudes Register 7 (TDR_PEAKS_AMP_7)
      124. 7.6.124 TDR Peak Amplitudes Register 8 (TDR_PEAKS_AMP_8)
      125. 7.6.125 TDR Peak Amplitudes Register 9 (TDR_PEAKS_AMP_9)
      126. 7.6.126 TDR Peak Amplitudes Register 10 (TDR_PEAKS_AMP_10)
      127. 7.6.127 TDR General Status (TDR_GEN_STATUS)
      128. 7.6.128 TDR Peak Sign AB (TDR_PEAK_SIGN_A_B)
      129. 7.6.129 TDR Peak Sign CD (TDR_PEAK_SIGN_C_D)
      130. 7.6.130 Programmable Gain Register (PROG_GAIN)
      131. 7.6.131 MMD3 PCS Control Register (MMD3_PCS_CTRL)
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Cable Line Driver
        2. 8.2.1.2 Clock In (XI) Recommendation
        3. 8.2.1.3 Crystal Recommendations
        4. 8.2.1.4 Clock Out (CLK_OUT) Phase Noise
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 MAC Interface
          1. 8.2.2.1.1 SGMII Layout Guidelines
          2. 8.2.2.1.2 RGMII Layout Guidelines
        2. 8.2.2.2 Media Dependent Interface (MDI)
          1. 8.2.2.2.1 MDI Layout Guidelines
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Signal Traces
        2. 8.4.1.2 Return Path
        3. 8.4.1.3 Transformer Layout
        4. 8.4.1.4 Metal Pour
        5. 8.4.1.5 PCB Layer Stacking
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision D (November 2022) to Revision E (February 2024)

  • Add SGMII output sectionGo
  • Remove the duplicate timing diagramGo
  • Edit Wake on Lan sectionGo
  • Edit Magic Packet StructureGo
  • Change Magic Packet ExampleGo
  • Edit Wake-on-LAN Configuration and StatusGo
  • Added section Section 7.3.2.1 Go
  • Edit Extended Address Space AccessGo
  • Edit Write (No Post Increment) OperationGo
  • Edit Read (No Post Increment) OperationGo
  • Edit Write (Post Increment) OperationGo
  • Edit Read (Post Increment) OperationGo
  • Clean up the languageGo
  • Clarify register 0x0004 half duplex advertisement bit Go
  • Updated Auto-Negotiation Advertisement Register (ANAR) registerGo
  • Edit default value for bit [1:0]Go
  • Added Section 7.6.37 register.Go
  • Add register 0x00A0 contentGo
  • Add register 0x00A1 contentGo
  • Add register 0x00A2 contentGo
  • Add register 0x00A3 contentGo
  • Added Section 7.6.54 register.Go
  • Add TDR Peak Sign infoGo
  • Updated the Cable Line Driver sectionGo
  • Add a note on power supply recommendation sesssion Go

Changes from Revision C (October 2019) to Revision D (November 2022)

  • Updated Start of Frame Detect for IEEE 1588 time stampGo
  • Updated Electrical CharacteristicsGo
  • Added Phy has internal 100 Ohm differential termination in Section 7.4.1.1 Go
  • Added following wording to the end of first paragraph in Section 7.4.3.9 "DP83867 devices manufactured after August, 2022, have an increased random seed value that now includes 255 different seed values to expedite Auto-MDIX resolution with a link partner."Go
  • Changed Bit 11:10 SPEED_OPT_ATTEMPT_CNT to RW description in Go
  • Changed bits 15:9, so that bit 12 can be '1'. Bit 7 description updated Section 7.6.31 Go
  • Added Register 0x008AGo
  • Added Register 0x00B3Go
  • Added Register 0x00C0Go
  • Added Register 0x0100Go

Changes from Revision B (March 2017) to Revision C (October 2019)

Changes from Revision A (February 2017) to Revision B (March 2017)

  • Changed pin 6 name in the pinout diagram from: VDDA1P0 to: VDD1P0Go
  • Changed INT / PWDN Interrupt descriptionGo
  • Changed RESERVED bit number from: 15:8 to: 15:9 Go
  • Changed RESERVED bit number from: 7 to: 8:7 Go
  • Changed the default and description of the CLK_O_DISABLE bit (bit 6)Go
  • Clarified Figure 8-2 Go
  • Changed text in MDI traces bullet from: or to: andGo

Changes from Revision * (October 2015) to Revision A (February 2017)

  • Updated data sheet text to the latest documentation and translations standardsGo
  • Added storage temperature to Section 6.1 Go
  • Updated parameter symbol from VIH to VIH Go
  • Added MDC toggling clarification to Section 6.7 Go
  • Added Section 6.11 Go
  • Added DP83867IS/CS Start of Frame Detection TimingGo
  • Added section Section 7.3.2.1 Go
  • Changed target strap voltage thresholds Table 7-5 Go
  • Changed values for RX_CTRL pin for modes 1 and 2 to N/A in Table 7-6 Go
  • Changed strap name SPEED_SEL to ANEG_SEL in Table 7-6 Go
  • Changed table name Speed Select Strap Details to Auto-Negotiation Select Strap Details in Table 7-7 Go
  • Changed strap option SPEED_SEL to ANEG_SEL in Table 7-7 Go
  • Changed mode 5 RGMII Clock Skew value from 4.0ns to 0ns in Table 7-8 Go
  • Changed strap control of Speed Select bit 13 in Table 7-10 Go
  • Changed strap control of Speed Select bit 6 in Table 7-10 Go
  • Changed bit 9 name from 100BASE-T FULL DUPLEX to 1000BASE-T FULL DUPLEX in Table 7-19 Go
  • Changed bit 9 descriptions from half duplex to full duplex in Table 7-19 Go
  • Changed 'Interrupt Status and Event Control Register (ISR)' to 'MII Interrupt Control Register (MICR)' in Section 7.6.16 Go
  • Changed Register definition to move a statement from Section 7.6.17 to Section 7.6.16 Go
  • Changed default of bit 9 from '1' to '0' in Table 7-28 Go
  • Changed default of bits 5:0 from '0' to '0 0111' in Table 7-28 Go
  • Added Section 7.6.29 registerGo
  • Added Section 7.6.37 registerGo
  • Changed SPEED_SEL strap bit name to ANEG_SEL in Strap Configuration Status Register 1 (STRAP_STS1), Address 0x006EGo
  • Changed name of Bit 6:4 from 'STRAP_GMII_CLK_SKEW_TX' to 'STRAP_RGMII_CLK_SKEW_TX' in Table 7-49 Go
  • Changed name of Bit 6:4 from 'STRAP_GMII_CLK_SKEW_RX' to 'STRAP_RGMII_CLK_SKEW_RX' in Table 7-49 Go
  • Added Section 7.6.54 registerGo
  • Changed default of bits 12:8 to 0 1100 in Table 7-114 Go
  • Changed description for IO_IMPEDANCE_CTRL bits in Section 7.6.104 Go
  • Changed Section 8.3 sectionGo
  • Added power down supply sequence sentence in Section 8.3 Go
  • Added Figure 8-9 Go
  • Added Table 8-5 Go
  • Added note regarding 1.8V supply sequence if no load exists on 2.5V supply in Layout Go