SNLS767A April   2024  – October 2024 DP83TC817S-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device Comparison Table
  6. 5Application Information
    1. 5.1 MAC Security
    2. 5.2 Time Syncronization
    3. 5.3 TC10 Sleep Wake-up
    4. 5.4 DP83TC817EVM-MC and Software Support
  7. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Support Resources
    3. 6.3 Community Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information
    1. 8.1 Package Option Addendum
      1. 8.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrostatic Discharge Caution

DP83TC817S-Q1 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.