SNLS604E September   2020  – November 2022 DP83TG720S-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2. 5.1 Pin States
    3. 5.2 Pin Power Domain
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 LED Drive Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Diagnostic Tool Kit
        1. 7.3.1.1 Signal Quality Indicator
        2. 7.3.1.2 Time Domain Reflectometry
        3. 7.3.1.3 Built-In Self-Test For Datapath
          1. 7.3.1.3.1 Loopback Modes
          2. 7.3.1.3.2 Data Generator
          3. 7.3.1.3.3 Programming Datapath BIST
        4. 7.3.1.4 Temperature and Voltage Sensing
        5. 7.3.1.5 Electrostatic Discharge Sensing
      2. 7.3.2 Compliance Test Modes
        1. 7.3.2.1 Test Mode 1
        2. 7.3.2.2 Test Mode 2
        3. 7.3.2.3 Test Mode 4
        4. 7.3.2.4 Test Mode 5
        5. 7.3.2.5 Test Mode 6
        6. 7.3.2.6 Test Mode 7
    4. 7.4 Device Functional Modes
      1. 7.4.1  Power Down
      2. 7.4.2  Reset
      3. 7.4.3  Standby
      4. 7.4.4  Normal
      5. 7.4.5  Sleep
      6. 7.4.6  State Transitions
        1. 7.4.6.1 State Transition #1 - Standby to Normal
        2. 7.4.6.2 State Transition #2 - Normal to Standby
        3. 7.4.6.3 State Transition #3 - Normal to Sleep
        4. 7.4.6.4 State Transition #4 - Sleep to Normal
      7. 7.4.7  Media Dependent Interface
        1. 7.4.7.1 MDI Master and MDI Slave Configuration
        2. 7.4.7.2 Auto-Polarity Detection and Correction
      8. 7.4.8  MAC Interfaces
        1. 7.4.8.1 Reduced Gigabit Media Independent Interface
        2. 7.4.8.2 Serial Gigabit Media Independent Interface
      9. 7.4.9  Serial Management Interface
      10. 7.4.10 Direct Register Access
      11. 7.4.11 Extended Register Space Access
      12. 7.4.12 Write Address Operation
        1. 7.4.12.1 Example - Write Address Operation
      13. 7.4.13 Read Address Operation
        1. 7.4.13.1 Example - Read Address Operation
      14. 7.4.14 Write Operation (No Post Increment)
        1. 7.4.14.1 Example - Write Operation (No Post Increment)
      15. 7.4.15 Read Operation (No Post Increment)
        1. 7.4.15.1 Example - Read Operation (No Post Increment)
      16. 7.4.16 Write Operation (Post Increment)
        1. 7.4.16.1 Example - Write Operation (Post Increment)
      17. 7.4.17 Read Operation (Post Increment)
        1. 7.4.17.1 Example - Read Operation (Post Increment)
    5. 7.5 Programming
      1. 7.5.1 Strap Configuration
      2. 7.5.2 LED Configuration
      3. 7.5.3 PHY Address Configuration
    6. 7.6 Register Maps
      1. 7.6.1 Register Access Summary
      2. 7.6.2 DP83TG720 Registers
        1. 7.6.2.1 Base Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
  9. 9 Power Supply Recommendations
  10. 10Compatibility with TI's 100BT1 PHY
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Signal Traces
      2. 11.1.2 Return Path
      3. 11.1.3 Physical Medium Attachment
      4. 11.1.4 Metal Pour
      5. 11.1.5 PCB Layer Stacking
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum
      1. 13.1.1 Packaging Information
      2. 13.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (March 2021) to Revision E (February 2022)

  • Updated the title of documentGo
  • Updated the Strap_1 pin state in the Pin Function table to input only. Separated the Pin states table and Pin Power domain tablesGo
  • Updated the INH pin in power/reset to PMOS, OD, O in the Pin States table. Updated abbreviationsGo
  • Added the Pin Power Domain TableGo
  • SQI section updated to indicate improved number of SQI levels with updated computation method.Go
  • Updated the link for the TDR application noteGo
  • Changed the 0x0016 register value to 0x0108, 0x0104, 0x0101 for analog loopback, digital loopback, and PCS loopback.Go
  • Updated the step of local and remote sleep entryGo
  • Formatted the bit descriptions for more clarity, removed the reserved registers and added extra registers as required by some customer applicationsGo
  • Updated the CM resistor packaging recommendation 0805Go

Changes from Revision C (February 2021) to Revision D (March 2021)

  • IOZ, 2 level boot-strap's Mode 2 threshold and Rpull-down min/max datasheet limits updated to give more margin to customer application.Go
  • Min/Max values of rgmii DLL_TX_DELAY, sleep mode timing parameters, latency parameters, reset mode power, standby mode power and sleep mode power added .Go
  • Changed Integrated Pull-Down Resistance from 4.5 kΩ to 4.725 kΩ.Go
  • Further details added to remote sleep exit procedure.Go
  • Note added for more margins for 1.8V two level straps.Go

Changes from Revision B (February 2021) to Revision C (February 2021)

  • Updated the Pull-down resistor value of rx_cntrl and strp_1 pins in pin-state tables. Changed from 6 K to 6.3 K to match exact value in the Specifications section .Go
  • SQI section updated to meet OA requirements.Go
  • Strap circuit diagram updated to remove external pull-down.Go

Changes from Revision A (December 2020) to Revision B (December 2020)

  • Updated Power Supply Recommendation NoteGo

Changes from Revision * (September 2020) to Revision A (December 2020)

  • Changed marketing status from Advance Information to initial release.Go