SNLS777A May   2024  – June 2024 DP83TG721R-Q1 , DP83TG721S-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device Comparison Table
  6. 5Application Information
    1. 5.1 Time Synchronization
    2. 5.2 Integrated Audio Over Ethernet
    3. 5.3 TC10 Sleep/Wake-Up
    4. 5.4 DP83TG721 EVM-MC and Software Support
    5. 5.5 Comparison of Device Features
  7. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Support Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  8. 7Revision History

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Electrostatic Discharge Caution

DP83TG721R-Q1 DP83TG721S-Q1 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.