SBOS704B May   2015  – March 2016 DRV421

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fluxgate Sensor
      2. 7.3.2  Integrator-Filter Function and Compensation Loop Stability
      3. 7.3.3  H-Bridge Driver for Compensation Coil
      4. 7.3.4  Shunt Sense Amplifier
      5. 7.3.5  Overrange Comparator
      6. 7.3.6  Voltage Reference
      7. 7.3.7  Overload Detection and Control
      8. 7.3.8  Magnetic Core Demagnetization
      9. 7.3.9  Search Function
      10. 7.3.10 Error Flag
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Magnetic Core Design
      2. 8.1.2 Protection Recommendations
    2. 8.2 Typical Application
      1. 8.2.1 Closed-Loop Current Sensing Module
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Differential Closed-Loop Current Sensing Module
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Using the DRV421 in ±15-V Sensor Applications
  9. 9 Power-Supply Recommendations
    1. 9.1 Power-Supply Decoupling
    2. 9.2 Power-On Start Up and Brownout
    3. 9.3 Power Dissipation
      1. 9.3.1 Thermal Pad
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.