SLIS162I December   2014  – February 2023 DRV5013-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Magnetic Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Field Direction Definition
      2. 7.3.2 Device Output
      3. 7.3.3 Power-On Time
      4. 7.3.4 Output Stage
      5. 7.3.5 Protection Circuits
        1. 7.3.5.1 Overcurrent Protection (OCP)
        2. 7.3.5.2 Load Dump Protection
        3. 7.3.5.3 Reverse Supply Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Standard Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Configuration Example
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Alternative Two-Wire Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
      2. 9.1.2 Device Markings
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision H (August 2018) to Revision I (February 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the document Go
  • Changed table title from: Device Information to: Package Information Go
  • Moved the Power Supply Recommendations and Layout sections to the Application and Implementation section Go

Changes from Revision G (October 2017) to Revision H (August 2018)

  • Changed Power Supply Recommendations section Go

Changes from Revision F (September 2016) to Revision G (October 2017)

  • Changed location of automotive-specific Features bullets to top of Features section Go
  • Added device HBM and CDM classification sub-bullets to automotive-specific Features bullet Go
  • Added last sentence to Device Functional Modes section Go

Changes from Revision E (August 2016) to Revision F (September 2016)

  • Made changes to the Power-on time in the Electrical Characteristics tableGo

Changes from Revision D (June 2016) to Revision E (August 2016)

  • Revised preliminary limits for FA version in the Magnetic Characteristics tableGo
  • Added the Layout sectionGo

Changes from Revision C (May 2016) to Revision D (June 2016)

  • Revised preliminary limits for the FA versionGo

Changes from Revision B (February 2016) to Revision C (May 2016)

  • Revised preliminary limits for the FA version Go

Changes from Revision A (December 2015) to Revision B (February 2016)

  • Added the FA device optionGo
  • Added the typical bandwidth value to the Magnetic Characteristics tableGo

Changes from Revision * (December 2014) to Revision A (June 2015)

  • Corrected body size of SOT-23 package and SIP package name to TO-92 Go
  • Added BMAX to Absolute Maximum Ratings Go
  • Removed table notes regarding testing for the operating junction temperature in Absolute Maximum Ratings Go
  • Added Community Resources Go
  • Updated package tape and reel options for M and blank Go