SLVSFY8B February   2020  – August 2021 DRV8210

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics DSG Package
    7. 7.7 Typical Characteristics DRL Package
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 External Components
      2. 8.3.2 Control Modes
        1. 8.3.2.1 PWM Control Mode (DSG: MODE = 0 and DRL)
        2. 8.3.2.2 PH/EN Control Mode (DSG: MODE = 1)
        3. 8.3.2.3 Half-Bridge Control Mode (DSG: MODE = Hi-Z)
      3. 8.3.3 Protection Circuits
        1. 8.3.3.1 Supply Undervoltage Lockout (UVLO)
        2. 8.3.3.2 OUTx Overcurrent Protection (OCP)
        3. 8.3.3.3 Thermal Shutdown (TSD)
      4. 8.3.4 Pin Diagrams
        1. 8.3.4.1 Logic-Level Inputs
        2. 8.3.4.2 Tri-Level Input
    4. 8.4 Device Functional Modes
      1. 8.4.1 Active Mode
      2. 8.4.2 Low-Power Sleep Mode
      3. 8.4.3 Fault Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Full-Bridge Driving
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Supply Voltage
          2. 9.2.1.2.2 Control Interface
          3. 9.2.1.2.3 Low-Power Operation
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Half-Bridge Driving
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Supply Voltage
          2. 9.2.2.2.2 Control Interface
          3. 9.2.2.2.3 Low-Power Operation
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Dual-Coil Relay Driving
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
          1. 9.2.3.2.1 Supply Voltage
          2. 9.2.3.2.2 Control Interface
          3. 9.2.3.2.3 Low-Power Operation
        3. 9.2.3.3 Application Curves
      4. 9.2.4 Current Sense
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
          1. 9.2.4.2.1 Shunt Resistor Sizing
          2. 9.2.4.2.2 RC Filter
    3. 9.3 Current Capability and Thermal Performance
      1. 9.3.1 Power Dissipation and Output Current Capability
      2. 9.3.2 Thermal Performance
        1. 9.3.2.1 Steady-State Thermal Performance
        2. 9.3.2.2 Transient Thermal Performance
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.2.2 Transient Thermal Performance

The motor driver may experience different transient driving conditions that cause large currents to flow for a short duration of time. These may include

  • Motor start-up when the rotor is initially stationary.
  • Fault conditions when there is a supply or ground short to one of the motor outputs, and the overcurrent protection triggers.
  • Briefly energizing a motor or solenoid for a limited time, then de-energizing.

For these transient cases, the duration of drive time is another factor that impacts thermal performance in addition to copper area and thickness. In transient cases, the thermal impedance parameter ZθJA denotes the junction-to-ambient thermal performance. The figures in this section show the simulated thermal impedances for 1-oz and 2-oz copper layouts for the WSON and SOT packages. These graphs indicate better thermal performance with short current pulses. For short periods of drive time, the device die size and package dominates the thermal performance. For longer drive pulses, board layout has a more significant impact on thermal performance. Both graphs show the curves for thermal impedance split due to number of layers and copper area as the duration of the drive pulse duration increases. Long pulses can be considered steady-state performance.

Figure 9-35 WSON package junction-to-ambient thermal impedance for 1-oz copper layouts
Figure 9-36 WSON package junction-to-ambient thermal impedance for 2-oz copper layouts
Figure 9-37 SOT package junction-to-ambient thermal impedance for 1-oz copper layouts
Figure 9-38 SOT package junction-to-ambient thermal impedance for 2-oz copper layouts