SLVSFV5A july   2023  – july 2023 DRV8262

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
      1. 6.4.1 Transient Thermal Impedance & Current Capability
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1  Overview
    2. 7.2  Functional Block Diagram
    3. 7.3  Feature Description
    4. 7.4  Device Operational Modes
      1. 7.4.1 Dual H-Bridge Mode (MODE1 = 0)
      2. 7.4.2 Single H-Bridge Mode (MODE1 = 1)
    5. 7.5  Current Sensing and Regulation
      1. 7.5.1 Current Sensing and Feedback
      2. 7.5.2 Current Regulation
        1. 7.5.2.1 Mixed Decay
        2. 7.5.2.2 Smart tune Dynamic Decay
      3. 7.5.3 Current Sensing with External Resistor
    6. 7.6  Charge Pump
    7. 7.7  Linear Voltage Regulator
    8. 7.8  VCC Voltage Supply
    9. 7.9  Logic Level, Tri-Level and Quad-Level Pin Diagrams
    10. 7.10 Protection Circuits
      1. 7.10.1 VM Undervoltage Lockout (UVLO)
      2. 7.10.2 VCP Undervoltage Lockout (CPUV)
      3. 7.10.3 Logic Supply Power on Reset (POR)
      4. 7.10.4 Overcurrent Protection (OCP)
      5. 7.10.5 Thermal Shutdown (OTSD)
      6. 7.10.6 nFAULT Output
      7. 7.10.7 Fault Condition Summary
    11. 7.11 Device Functional Modes
      1. 7.11.1 Sleep Mode
      2. 7.11.2 Operating Mode
      3. 7.11.3 nSLEEP Reset Pulse
      4. 7.11.4 Functional Modes Summary
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Driving Brushed-DC Motors
        1. 8.1.1.1 Brushed-DC Motor Driver Typical Application
        2. 8.1.1.2 Power Loss Calculations - Dual H-bridge
        3. 8.1.1.3 Power Loss Calculations - Single H-bridge
        4. 8.1.1.4 Junction Temperature Estimation
        5. 8.1.1.5 Application Performance Plots
      2. 8.1.2 Driving Stepper Motors
        1. 8.1.2.1 Stepper Driver Typical Application
        2. 8.1.2.2 Power Loss Calculations
        3. 8.1.2.3 Junction Temperature Estimation
      3. 8.1.3 Driving Thermoelectric Coolers (TEC)
  10. Package Thermal Considerations
    1. 9.1 DDW Package
      1. 9.1.1 Thermal Performance
        1. 9.1.1.1 Steady-State Thermal Performance
        2. 9.1.1.2 Transient Thermal Performance
    2. 9.2 DDV Package
    3. 9.3 PCB Material Recommendation
  11. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
    2. 10.2 Power Supplies
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Shutdown (OTSD)

Thermal shutdown is detected if the die temperature exceeds the thermal shutdown limit (TOTSD). When thermal shutdown is detected -
  • All MOSFETs are disabled

  • nFAULT is driven low

  • Charge pump is disabled

Once the thermal shutdown condition is removed, the recovery mechanism depends on the OCPM pin setting. OCPM pin programs either latch-off or automatic retry type recovery.

  • When the OCPM pin is logic low, the device has latch-off type recovery - which means after the junction temperature falls below the overtemperature threshold limit minus the hysteresis (TOTSD – THYS_OTSD), normal operation resumes after applying an nSLEEP reset pulse or a power cycling.

  • When the OCPM pin is logic high, normal operation resumes automatically after the junction temperature falls below the overtemperature threshold limit minus the hysteresis (TOTSD – THYS_OTSD).