SLES256F May   2010  – May 2022 DRV8312 , DRV8332

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Dissipation Ratings
    6. 6.6 Power Deratings (DRV8312)
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Error Reporting
      2. 7.3.2 Device Protection System
        1. 7.3.2.1 Bootstrap Capacitor Undervoltage Protection
          1. 7.3.2.1.1 Overcurrent (OC) Protection
        2. 7.3.2.2 Overtemperature Protection
        3. 7.3.2.3 Undervoltage Protection (UVP) and Power-On Reset (POR)
        4. 7.3.2.4 Device Reset
    4. 7.4 Device Functional Modes
      1. 7.4.1 Different Operational Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Three-Phase Operation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Motor Voltage
          2. 8.2.1.2.2 Current Requirement of 12 V Power Supply
          3. 8.2.1.2.3 Voltage of Decoupling Capacitor
          4. 8.2.1.2.4 Overcurrent Threshold
          5. 8.2.1.2.5 Sense Resistor
          6. 8.2.1.2.6 Output Inductor Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DRV8312 Application Diagram for Three-Phase Operation
      3. 8.2.3 Control Signal Logic With Conventional 6 PWM Input Scheme
      4. 8.2.4 Hall Sensor Control With 6 Steps Trapezoidal Scheme
      5. 8.2.5 Sensorless Control With 6 Steps Trapezoidal Scheme
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
    2. 9.2 System Power-Up and Power-Down Sequence
      1. 9.2.1 Powering Up
      2. 9.2.2 Powering Down
    3. 9.3 System Design Recommendations
      1. 9.3.1 VREG Pin
      2. 9.3.2 VDD Pin
      3. 9.3.3 OTW Pin
      4. 9.3.4 FAULT Pin
      5. 9.3.5 OC_ADJ Pin
      6. 9.3.6 PWM_X and RESET_X Pins
      7. 9.3.7 Mode Select Pins
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Material Recommendation
      2. 10.1.2 Ground Plane
      3. 10.1.3 Decoupling Capacitor
      4. 10.1.4 AGND
    2. 10.2 Layout Example
      1. 10.2.1 Current Shunt Resistor
        1. 10.2.1.1 66
    3. 10.3 Thermal Considerations
      1. 10.3.1 Thermal Via Design Recommendation
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

Over operating free-air temperature range unless otherwise noted(1)
MINMAXUNIT
VDD to GND–0.313.2V
GVDD_X to GND–0.313.2V
PVDD_X to GND_X (2)–0.370V
OUT_X to GND_X (2)–0.370V
BST_X to GND_X (2)–0.380V
Transient peak output current (per pin), pulse width limited by internal overcurrent protection circuit16A
Transient peak output current for latch shut down (per pin)20A
VREG to AGND–0.34.2V
GND_X to GND–0.30.3V
GND to AGND–0.30.3V
PWM_X, RESET_X to GND–0.3VREG + 0.5V
OC_ADJ, M1, M2, M3 to AGND–0.34.2V
FAULT, OTW to GND–0.37V
Continuous sink current ( FAULT, OTW)9mA
Operating junction temperature, TJ–40150°C
Storage temperature, Tstg–55150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Section 6.3 is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) These are the maximum allowed voltages for transient spikes. Absolute maximum DC voltages are lower.