SLES242H December   2009  – July 2024 DRV8412

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Package Heat Dissipation Ratings
    6. 5.6 Package Power Deratings (DRV8412) #GUID-2A6DB468-D895-404F-A2E6-05A442AE2834/SLES2429141
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Error Reporting
      2. 6.3.2 Device Protection System
        1. 6.3.2.1 Bootstrap Capacitor Undervoltage Protection
        2. 6.3.2.2 Overcurrent (OC) Protection
        3. 6.3.2.3 Overtemperature Protection
        4. 6.3.2.4 Undervoltage Protection (UVP) and Power-On Reset (POR)
      3. 6.3.3 Device Reset
    4. 6.4 Device Functional Modes
  8.   Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Full Bridge Mode Operation
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Motor Voltage
          2. 7.2.1.2.2 Current Requirement of 12V Power Supply
          3. 7.2.1.2.3 Voltage of Decoupling Capacitor
          4. 7.2.1.2.4 Overcurrent Threshold
          5. 7.2.1.2.5 Sense Resistor
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Parallel Full Bridge Mode Operation
      3. 7.2.3 Stepper Motor Operation
      4. 7.2.4 TEC Driver
      5. 7.2.5 LED Lighting Driver
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Bulk Capacitance
      2. 7.3.2 Power Supplies
      3. 7.3.3 System Power-Up and Power-Down Sequence
        1. 7.3.3.1 Powering Up
        2. 7.3.3.2 Powering Down
      4. 7.3.4 System Design Recommendations
        1. 7.3.4.1 VREG Pin
        2. 7.3.4.2 VDD Pin
        3. 7.3.4.3 OTW Pin
        4. 7.3.4.4 Mode Select Pin
        5. 7.3.4.5 Parallel Mode Operation
        6. 7.3.4.6 TEC Driver Application
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Material Recommendation
        2. 7.4.1.2 Ground Plane
        3. 7.4.1.3 Decoupling Capacitor
        4. 7.4.1.4 AGND
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Current Shunt Resistor
      3. 7.4.3 Thermal Considerations
        1. 7.4.3.1 DRV8412 Thermal Via Design Recommendation
  9. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  10. 8Revision History
  11. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Revision History

Changes from Revision G (July 2014) to Revision H (July 2024)

  • Changed the Device Information table to the Package Information tableGo
  • Deleted values in 39 to 200 in Table 6-2 Go

Changes from Revision F (January 2014) to Revision G (July 2014)

  • Added ESD Ratingstable, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from Revision E (October 2013) to Revision F (January 2014)

  • Changed GND_A, GND_B, GND_C, and GND_D pins description to remove text "requires close decoupling capacitor to ground"Go
  • Changed the tON_MIN description to include "for charging the Bootstrap capacitor"Go
  • Added text to the Overcurrent (OC) Protection section - "It is important to note..." Go

Changes from Revision D (July 2011) to Revision E (October 2013)

  • Added last sentence in description of Thermal Pad in Pin Functions table.Go
  • Added THERMAL INFORMATION tableGo
  • Added a new paragraph in DIFFERENT OPERATIONAL MODES section: In operation modes.....DC logic level.Go

Changes from Revision C (May 2010) to Revision D (July 2011)

  • Changed from 80mΩ to 110mΩ in first FeatureGo
  • Changed from 50V to 52V in second FeatureGo
  • Deleted (70V Absolute Maximum) from second FeatureGo
  • Added LED Lighting Drivers to ApplicationsGo
  • Added Includes metallization bond wire and pin resistance to RDS(on) test conditionsGo
  • Changed RDS(on) typ from 80 mΩ to 110 mΩGo
  • Added text to 5th paragraph of Overcurrent (OC) Protection sectionGo
  • Deleted Output Inductor Selection section and moved information into Overcurrent (OC) Protection sectionGo
  • Changed Figure 7-1 Go
  • Changed Figure 7-9 Go
  • Deleted Application Diagram Example for Three Phase PMSM PVDD Sense Operation and Application Diagram Example for Three Phase PMSM GND Sense Operation figuresGo
  • Added Figure 7-11 Go
  • Changed Figure 7-13 Go

Changes from Revision B (Jan 2010) to Revision C ()

  • Deleted all DRV8422 related descriptions from this data sheetGo
  • Changed the DRV8432 pinoutGo
  • Added Thermal Pad and Heat slug rows to end of Pin Functions table. Also added T=thermal in noteGo
  • Added second paragraph to Bootstrap Capacitor....sectionGo
  • Deleted or GVDD undervoltage from DEVICE RESET section second paragraphGo

Changes from Revision A (December 2009) to Revision B ()

  • Added TA = 125°C power rating of 1.0 W to package power deratings tableGo