SLLSFB6B May   2020  – May 2024 DRV8705-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Descriptions
  5.   Device Comparison Table
  6. 4 Pin Configuration
  7. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 External Components
      2. 6.3.2 Device Interface Variants
        1. 6.3.2.1 Serial Peripheral Interface (SPI)
        2. 6.3.2.2 Hardware (H/W)
      3. 6.3.3 Input PWM Modes
        1. 6.3.3.1 Half-Bridge Control
        2. 6.3.3.2 H-Bridge Control
        3. 6.3.3.3 Split HS and LS Solenoid Control
      4. 6.3.4 Smart Gate Driver
        1. 6.3.4.1 Functional Block Diagram
        2. 6.3.4.2 Slew Rate Control (IDRIVE)
        3. 6.3.4.3 Gate Drive State Machine (TDRIVE)
      5. 6.3.5 Doubler (Single-Stage) Charge Pump
      6. 6.3.6 Low-Side Differential Current Shunt Amplifier
      7. 6.3.7 Pin Diagrams
        1. 6.3.7.1 Logic Level Input Pin (DRVOFF, IN1/EN, IN2/PH, nHIZx, nSLEEP, nSCS, SCLK, SDI)
        2. 6.3.7.2 Logic Level Push Pull Output (SDO)
        3. 6.3.7.3 Logic Level Open Drain Output (nFAULT)
        4. 6.3.7.4 Quad-Level Input (GAIN)
        5. 6.3.7.5 Six-Level Input (IDRIVE, VDS)
      8. 6.3.8 Protection and Diagnostics
        1. 6.3.8.1  Gate Driver Disable and Enable (DRVOFF and EN_DRV)
        2. 6.3.8.2  Fault Reset (CLR_FLT)
        3. 6.3.8.3  DVDD Logic Supply Power on Reset (DVDD_POR)
        4. 6.3.8.4  PVDD Supply Undervoltage Monitor (PVDD_UV)
        5. 6.3.8.5  PVDD Supply Overvoltage Monitor (PVDD_OV)
        6. 6.3.8.6  VCP Charge Pump Undervoltage Lockout (VCP_UV)
        7. 6.3.8.7  MOSFET VDS Overcurrent Protection (VDS_OCP)
        8. 6.3.8.8  Gate Driver Fault (VGS_GDF)
        9. 6.3.8.9  Thermal Warning (OTW)
        10. 6.3.8.10 Thermal Shutdown (OTSD)
        11. 6.3.8.11 Offline Short Circuit and Open Load Detection (OOL and OSC)
        12. 6.3.8.12 Fault Detection and Response Summary Table
    4. 6.4 Device Function Modes
      1. 6.4.1 Inactive or Sleep State
      2. 6.4.2 Standby State
      3. 6.4.3 Operating State
    5. 6.5 Programming
      1. 6.5.1 SPI Interface
      2. 6.5.2 SPI Format
      3. 6.5.3 SPI Interface for Multiple Slaves
        1. 6.5.3.1 SPI Interface for Multiple Slaves in Daisy Chain
  9. 7 Register Maps
    1. 7.1 STATUS Registers
    2. 7.2 CONTROL Registers
  10. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Gate Driver Configuration
          1. 8.2.2.1.1 VCP Load Calculation Example
          2. 8.2.2.1.2 IDRIVE Calculation Example
        2. 8.2.2.2 Current Shunt Amplifier Configuration
        3. 8.2.2.3 Power Dissipation
  11. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  12. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  13. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
      2. 11.1.2 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  14. 12Revision History
  15. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • AEC-Q100 qualified for automotive applications:
    • Temperature grade 1: –40°C to +125°C, TA
  • Functional Safety-Capable
  • H-bridge smart gate driver
    • 4.9V to 37V (40V abs. max) operating range
    • Doubler charge pump for 100% PWM
    • Half-bridge and H-bridge control modes
  • Pin to pin gate driver variants
  • Smart gate drive architecture
    • Adjustable slew rate control
    • 0.5mA to 62mA peak source current output
    • 0.5mA to 62mA peak sink current output
    • Integrated dead-time handshaking
  • Low-side current shunt amplifier
    • Adjustable gain settings (10, 20, 40, 80V/V)
    • Integrated feedback resistors
    • Adjustable PWM blanking scheme
  • Multiple interface options available
    • SPI: Detailed configuration and diagnostics
    • H/W: Simplified control and less MCU pins
  • Spread spectrum clocking for EMI reduction
  • Compact VQFN package with wettable flanks
  • Integrated protection features
    • Dedicated driver disable pin (DRVOFF)
    • Supply and regulator voltage monitors
    • MOSFET VDS overcurrent monitors
    • MOSFET VGS gate fault monitors
    • Charge pump for reverse polarity MOSFET
    • Offline open load and short circuit diagnostics
    • Device thermal warning and shutdown
    • Fault condition interrupt pin (nFAULT)