SLLSFB6B May   2020  – May 2024 DRV8705-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Descriptions
  5.   Device Comparison Table
  6. 4 Pin Configuration
  7. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 External Components
      2. 6.3.2 Device Interface Variants
        1. 6.3.2.1 Serial Peripheral Interface (SPI)
        2. 6.3.2.2 Hardware (H/W)
      3. 6.3.3 Input PWM Modes
        1. 6.3.3.1 Half-Bridge Control
        2. 6.3.3.2 H-Bridge Control
        3. 6.3.3.3 Split HS and LS Solenoid Control
      4. 6.3.4 Smart Gate Driver
        1. 6.3.4.1 Functional Block Diagram
        2. 6.3.4.2 Slew Rate Control (IDRIVE)
        3. 6.3.4.3 Gate Drive State Machine (TDRIVE)
      5. 6.3.5 Doubler (Single-Stage) Charge Pump
      6. 6.3.6 Low-Side Differential Current Shunt Amplifier
      7. 6.3.7 Pin Diagrams
        1. 6.3.7.1 Logic Level Input Pin (DRVOFF, IN1/EN, IN2/PH, nHIZx, nSLEEP, nSCS, SCLK, SDI)
        2. 6.3.7.2 Logic Level Push Pull Output (SDO)
        3. 6.3.7.3 Logic Level Open Drain Output (nFAULT)
        4. 6.3.7.4 Quad-Level Input (GAIN)
        5. 6.3.7.5 Six-Level Input (IDRIVE, VDS)
      8. 6.3.8 Protection and Diagnostics
        1. 6.3.8.1  Gate Driver Disable and Enable (DRVOFF and EN_DRV)
        2. 6.3.8.2  Fault Reset (CLR_FLT)
        3. 6.3.8.3  DVDD Logic Supply Power on Reset (DVDD_POR)
        4. 6.3.8.4  PVDD Supply Undervoltage Monitor (PVDD_UV)
        5. 6.3.8.5  PVDD Supply Overvoltage Monitor (PVDD_OV)
        6. 6.3.8.6  VCP Charge Pump Undervoltage Lockout (VCP_UV)
        7. 6.3.8.7  MOSFET VDS Overcurrent Protection (VDS_OCP)
        8. 6.3.8.8  Gate Driver Fault (VGS_GDF)
        9. 6.3.8.9  Thermal Warning (OTW)
        10. 6.3.8.10 Thermal Shutdown (OTSD)
        11. 6.3.8.11 Offline Short Circuit and Open Load Detection (OOL and OSC)
        12. 6.3.8.12 Fault Detection and Response Summary Table
    4. 6.4 Device Function Modes
      1. 6.4.1 Inactive or Sleep State
      2. 6.4.2 Standby State
      3. 6.4.3 Operating State
    5. 6.5 Programming
      1. 6.5.1 SPI Interface
      2. 6.5.2 SPI Format
      3. 6.5.3 SPI Interface for Multiple Slaves
        1. 6.5.3.1 SPI Interface for Multiple Slaves in Daisy Chain
  9. 7 Register Maps
    1. 7.1 STATUS Registers
    2. 7.2 CONTROL Registers
  10. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Gate Driver Configuration
          1. 8.2.2.1.1 VCP Load Calculation Example
          2. 8.2.2.1.2 IDRIVE Calculation Example
        2. 8.2.2.2 Current Shunt Amplifier Configuration
        3. 8.2.2.3 Power Dissipation
  11. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  12. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  13. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
      2. 11.1.2 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  14. 12Revision History
  15. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) DRV8705-Q1   UNIT
RHB (VQFN)
32 PINS
RθJA Junction-to-ambient thermal resistance 34.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 25.6 °C/W
RθJB Junction-to-board thermal resistance 15.0 °C/W
ΨJT Junction-to-top characterization parameter 0.5 °C/W
ΨJB Junction-to-board characterization parameter 15.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.