SLVSF67B August 2019 – January 2021 DRV8874-Q1
PRODUCTION DATA
THERMAL METRIC(1) | DRV8874-Q1 | UNIT | |
---|---|---|---|
PWP (HTSSOP) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 36.0 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 27.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 11.1 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.4 | °C/W |
ΨJB | Junction-to-board characterization parameter | 11.0 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.7 | °C/W |