SLVSDA4C January   2017  – March 2020 DRV8886

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Indexer Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Stepper Motor Driver Current Ratings
        1. 7.3.1.1 Peak Current Rating
        2. 7.3.1.2 rms Current Rating
        3. 7.3.1.3 Full-Scale Current Rating
      2. 7.3.2  PWM Motor Drivers
      3. 7.3.3  Microstepping Indexer
      4. 7.3.4  Current Regulation
      5. 7.3.5  Controlling RREF With an MCU DAC
        1. 7.3.5.1 Various Sources of Error
          1. 7.3.5.1.1 VRREF, ARREF, and RREF Error
          2. 7.3.5.1.2 VDAC Error
        2. 7.3.5.2 Application-Specific Error Calculations
      6. 7.3.6  Decay Modes
        1. 7.3.6.1 Mode 1: Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
        2. 7.3.6.2 Mode 2: Mixed Decay for Increasing and Decreasing Current
        3. 7.3.6.3 Mode 3: Slow Decay for Increasing and Decreasing Current
      7. 7.3.7  Blanking Time
      8. 7.3.8  Charge Pump
      9. 7.3.9  Linear Voltage Regulators
      10. 7.3.10 Logic and Multi-Level Pin Diagrams
      11. 7.3.11 Protection Circuits
        1. 7.3.11.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.11.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.11.3 Overcurrent Protection (OCP)
        4. 7.3.11.4 Thermal Shutdown (TSD)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.11.4 Thermal Shutdown (TSD)

If the die temperature exceeds TTSD level, all MOSFETs in the H-bridge are disabled and the nFAULT pin is driven low. When the die temperature falls below the TTSD level, operation automatically resumes. The nFAULT pin is released after operation resumes.

Table 23. Fault Condition Summary

FAULT CONDITION ERROR REPORT H-BRIDGE CHARGE PUMP INDEXER DVDD AVDD RECOVERY
VM undervoltage (UVLO) VM < VUVLO
(max 7.8 V)		 nFAULT Disabled Disabled Disabled Operating Disabled VM > VUVLO
(max 8 V)
VCP undervoltage (CPUV) VCP < VCPUV
(typ VM + 2 V)		 nFAULT Disabled Operating Operating Operating Operating VCP > VCPUV
(typ VM + 2.7 V)
Overcurrent (OCP) IOUT > IOCP
(min 3 A)		 nFAULT Disabled Operating Operating Operating Operating tRETRY
Thermal shutdown (TSD) TJ > TTSD
(min 150°C)		 nFAULT Disabled Operating Operating Operating Operating TJ < TTSD – THYS
(THYS typ 20°C)