SLVSHN2 July   2024 DRV8962-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Feature Description
    4. 6.4  Independent Half-bridge Operation
    5. 6.5  Current Sensing and Regulation
      1. 6.5.1 Current Sensing and Feedback
      2. 6.5.2 Current Sensing with External Resistor
      3. 6.5.3 Current Regulation
    6. 6.6  Charge Pump
    7. 6.7  Linear Voltage Regulator
    8. 6.8  VCC Voltage Supply
    9. 6.9  Logic Level Pin Diagram
    10. 6.10 Protection Circuits
      1. 6.10.1 VM Undervoltage Lockout (UVLO)
      2. 6.10.2 VCP Undervoltage Lockout (CPUV)
      3. 6.10.3 Logic Supply Power on Reset (POR)
      4. 6.10.4 Overcurrent Protection (OCP)
      5. 6.10.5 Thermal Shutdown (OTSD)
      6. 6.10.6 nFAULT Output
      7. 6.10.7 Fault Condition Summary
    11. 6.11 Device Functional Modes
      1. 6.11.1 Sleep Mode
      2. 6.11.2 Operating Mode
      3. 6.11.3 nSLEEP Reset Pulse
      4. 6.11.4 Functional Modes Summary
  8. 7Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Driving Solenoid Loads
        1. 7.1.1.1 Solenoid Driver Typical Application
        2. 7.1.1.2 Thermal Calculations
          1. 7.1.1.2.1 Power Loss Calculations
          2. 7.1.1.2.2 Junction Temperature Estimation
        3. 7.1.1.3 Application Performance Plots
      2. 7.1.2 Driving Stepper Motors
        1. 7.1.2.1 Stepper Driver Typical Application
        2. 7.1.2.2 Power Loss Calculations
        3. 7.1.2.3 Junction Temperature Estimation
      3. 7.1.3 Driving Brushed-DC Motors
        1. 7.1.3.1 Brushed-DC Driver Typical Application
        2. 7.1.3.2 Power Loss Calculation
        3. 7.1.3.3 Junction Temperature Estimation
        4. 7.1.3.4 Driving Single Brushed-DC Motor
      4. 7.1.4 Driving Thermoelectric Coolers (TEC)
      5. 7.1.5 Driving Brushless DC Motors
    2. 7.2 Package Thermal Considerations
      1. 7.2.1 Thermal Performance
        1. 7.2.1.1 Steady-State Thermal Performance
        2. 7.2.1.2 Transient Thermal Performance
      2. 7.2.2 PCB Material Recommendation
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Bulk Capacitance
      2. 7.3.2 Power Supplies
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8Device and Documentation Support
    1. 8.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.1.2 Transient Thermal Performance

The driver may experience different transient driving conditions that cause large currents to flow for a short duration of time. These may include -

  • Motor start-up when the rotor is initially stationary.
  • Fault conditions when there is a supply or ground short to one of the motor outputs, and the overcurrent protection triggers.
  • Briefly energizing a motor or solenoid for a limited time, then de-energizing.

For these transient cases, the duration of drive time is another factor that impacts thermal performance in addition to copper area and thickness. In transient cases, the thermal impedance parameter ZθJA denotes the junction-to-ambient thermal performance. The figures in this section show the simulated thermal impedances for 1-oz and 2-oz copper layouts. These graphs indicate better thermal performance with short current pulses. For short periods of drive time, the device die size and package dominates the thermal performance. For longer drive pulses, board layout has a more significant impact on thermal performance. Both graphs show the curves for thermal impedance split due to number of layers and copper area as the duration of the drive pulse duration increases. Long pulses can be considered steady-state performance.

DRV8962-Q1 Junction-to-ambient thermal impedance for 1-oz copper layoutsFigure 7-14 Junction-to-ambient thermal impedance for 1-oz copper layouts
DRV8962-Q1 Junction-to-ambient thermal impedance for 2-oz copper layoutsFigure 7-15 Junction-to-ambient thermal impedance for 2-oz copper layouts