SNOSC82B August   2012  – June 2015 DS1776QML

PRODUCTION DATA.  

  1. 1Features
  2. 2Description
  3. 3Revision History
  4. 4Pin Configuration and Functions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommend Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Quality Conformance Inspection
    6. 5.6  Pi Bus Transceiver DS1776 DC Parameters
    7. 5.7  Pi Bus Transceiver DS1776 AC Parameters: B To A Path
    8. 5.8  Pi Bus Transceiver DS1776 AC Parameters: A To B Path
    9. 5.9  Pi Bus Transceiver DS1776 AC Parameters: Setup / Hold / Pulse Width Specifications
    10. 5.10 Test Circuit And Waveforms
      1. 5.10.1 Test Circuit For TRI-STATE Outputs On A Side
      2. 5.10.2 Test Circuit For TRI-STATE Outputs On B Side
      3. 5.10.3 Input Pulse Definition
  6. 6Detailed Description
    1. 6.1 Controller Power Sequencing Operation
  7. 7Device and Documentation Support
    1. 7.1 Community Resources
    2. 7.2 Trademarks
    3. 7.3 Electrostatic Discharge Caution
    4. 7.4 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Specifications

5.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
Supply Voltage (VCC) −0.5 7.0 V
VX, VOH Output Level Control Voltage (A Outputs) −0.5 7.0 V
OEBn, OEA, LE Input Voltage (VI) −0.5 7.0 V
A0–A7, B0–B7 Input Voltage (VI) −0.5 5.5 V
Input Current (II) −40 5 mA
Voltage Applied to Output in High Output State (VO) −0.5V +VCC
A0–A7 Current Applied to Output in Low Output State (IO) 40 40 mA
B0–B7 Current Applied to Output in Low Output State (IO) 200 200 mA
Lead Temperature (Soldering 10 Sec.) 260 °C
Power Dissipation (2) 740 mW
Storage temperature Tstg −65 +150 °C

5.2 ESD Ratings

MIN MAX UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)(2) 500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) CZap = 120 pF, RZap = 1500Ω

5.3 Recommend Operating Conditions

MIN MAX UNIT
Supply Voltage (VCC) 4.5 5.5 V
Operating Temp. Range (TA) −55 +125 °C

5.4 Thermal Information

THERMAL METRIC(1) DS1776QML UNIT
FK0028A
28 PINS
RθJA Junction-to-ambient thermal resistance +67.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance See MIL-STD-1835 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

5.5 Quality Conformance Inspection

Table 1. Mil-Std-883, Method 5005 - Group A

Subgroup Description Temp (°C)
1 Static tests at +25
2 Static tests at +125
3 Static tests at -55
4 Dynamic tests at +25
5 Dynamic tests at +125
6 Dynamic tests at -55
7 Functional tests at +25
8A Functional tests at +125
8B Functional tests at -55
9 Switching tests at +25
10 Switching tests at +125
11 Switching tests at -55
12 Settling time at +25
13 Settling time at +125
14 Settling time at -55

5.6 Pi Bus Transceiver DS1776 DC Parameters

The following conditions apply, unless otherwise specified. VCC = 5.5V
SYMBOL PARAMETER CONDITIONS NOTES MIN MAX UNIT SUB- GROUPS
VIL2 Low Level In Voltage Bn VCC = 4.5 See(3) 1.45 V 1, 2, 3
VIL1 All Other Inputs VCC = 4.5 .8 V 1, 2, 3
VIH1 Hi Level Input Voltage OEBn, OEA, An, LE See(3) 2.0 V 1, 2, 3
VIH2 High Level In Voltage B0-B7 1.6 V 1, 2, 3
IOH1 High Level Output Current An VCC = 4.5, VIN = VIH or VIL,
VOH = 2.5V		 See(4) -3.0 mA 1, 2, 3
IOH2 High Level Output Current Bn VCC = 5.5, VIL = 0.8V,
VIH = 2.0V, VOH = 2.1V		 100 µA 1, 2, 3
IOL1 Low Level Output Current An VCC = 4.5, VIN = VIH or VIL,
VOL = 0.5V		 See(5) 20 mA 1, 2, 3
IOL2 Low Level Output Current Bn VCC = 4.5, VIN = VIH or VIL,
VOL = 1.15V		 100 mA 1, 2, 3
VOH High Level Output Voltage An VCC = 4.5, VIN = VIL or VIH,
IOH = -3 mA, VX = 4.5V		 2.5 4.5 V 1, 2, 3
VCC = 4.5, VIN = VIL or VIH,
IOH = -0.4 mA,
VX = 3.13 to 3.47V		 2.5 VX V 1, 2, 3
VOL Low Level Output Voltage An VCC = 4.5, VIL = Max,
VIH = Min, IOL = 20mA,
VX = VCC		 0.5 V 1, 2, 3
VOLB Low Level Output Voltage Bn VCC = 4.5, VIL = Max,
VIH = Min, IOL = 100mA		 1.15 V 1, 2, 3
VCC = 4.5, VIL = Max,
VIH = Min, IOL = 4mA		 0.4 V 1, 2, 3
VIK Input Clamp Voltage An VCC = 4.5, II = -40mA -0.5 V 1, 2, 3
VIK Input Clamp Voltage Other Inputs VCC = 4.5, II = -18mA -1.2 V 1, 2, 3
IIH1 Input Current Max Input Voltage OEBn, OEA, LE VCC = 5.5, VI = 7.0V 100 µA 1, 2, 3
IIH2 Input Current Max Input Voltage An, Bn VCC = 5.5, VI = 5.5V 1.0 mA 1, 2, 3
IIH3 High Level Input Current OEBn, OEA, LE VCC = 5.5, VI = 2.7V 20 µA 1, 2, 3
IIH4 High Level Input Current Bn VCC = 5.5, VI = 2.1V 100 µA 1, 2, 3
IIL1 Low Level Input Current OEBn, OEA, Except OEBn or OEA VCC = 5.5, VI = 0.5V -20 µA 1, 2, 3
IIL2 Low Level Input Current LE VCC = 5.5, VI = 0.5V -20 µA 1
-40 µA 2, 3
IIL3 Low Level Input Current Bn VCC = 5.5, VI = 0.3V -100 µA 1, 2, 3
IOZH + IIH TRI-STATE Output Current, High Level Voltage Applied An VCC = 5.5, VO = 2.7V 70 µA 1, 2, 3
IOZL + IIL TRI-STATE Output Current, Low Level Voltage Applied An VCC = 5.5, VO = 0.5V -70 µA 1, 2, 3
IX High Level Control Current VCC = 5.5, VX = 5.5V,
LE = OEA = OEBn = 2.7V,
A0-A7 = 2.7, B0-B7 = 2V		 -100 100 µA 1, 2, 3
VCC = 5.5, B0-B7 = 2V
VX = 3.13V and 3.47V,
LE = OEA = 2.7V,
OEBn = A0-A7 = 2.7V, 		-10 10 mA 1, 2, 3
IOS Short Circuit Output Current A0-A7 only VCC = 5.5, Bn = 1.9V,
OEA = 2.0V, OEBn = 2.7V,
VO = 0V		 See(6) -60 -150 mA 1, 2, 3
ICCH Supply Current (Total) ICCH VCC = 5.5, VIN (An) = 5.0V 37 mA 1, 2
41 mA 3
ICCL Supply Current (Total) ICCL VCC = 5.5, VIN (An) = 0.5V 38 mA 1, 3
34 mA 2
ICCZ Supply Current (Total) ICCZ VCC = 5.5, VIN (An) = 0.5V 35 mA 1, 2, 3
IOff Power Off Output Current B0-B7 VCC = 0, Bn = 2.1V, VIL = Max,
VIH = Min		 100 µA 1, 2, 3

5.7 Pi Bus Transceiver DS1776 AC Parameters: B To A Path

The following conditions apply, unless otherwise specified. VCC = 5V ±10%, CL = 50pF, RL = 500Ω
SYMBOL PARAMETER CONDITIONS NOTES MIN MAX UNIT SUB- GROUPS
tPLH Propagation Delay B to A Waveform 1, 2 4.5 17 ns 9, 10, 11
tPHL Propagation Delay B to A Waveform 1, 2 6.0 17 ns 9, 10, 11
tPZH Output Enable OEA To A Waveform 3, 4 4.0 17 ns 9, 10, 11
tPZL Output Enable OEA To A Waveform 3, 4 4.0 21 ns 9, 10, 11
tPHZ Output Disable OEA to A Waveform 3, 4 2.0 12 ns 9, 10, 11
tPLZ Output Disable OEA to A Waveform 3, 4 2.0 13 ns 9, 10, 11

5.8 Pi Bus Transceiver DS1776 AC Parameters: A To B Path

The following conditions apply, unless otherwise specified. VCC = 5V ±10%, CL = 30pF, RL = 9Ω
SYMBOL PARAMETER CONDITIONS NOTES MIN MAX UNIT SUB- GROUPS
tPLH Propagation Delay A to B Waveform 1, 2 2.0 13 ns 9, 11
2.0 17 ns 10
tPHL Propagation Delay A to B Waveform 1, 2 2.5 13 ns 9, 10, 11
tPLH Propagation Delay LE to B Waveform 1, 2 2.0 16 ns 9, 11
2.0 22 ns 10
tPHL Propagation Delay LE to B Waveform 1, 2 2.0 16 ns 9, 10, 11
tPLH Enable / Disable Time OEBn to B Waveform 1, 2 2.0 13 ns 9, 11
2.0 16 ns 10
tPHL Enable / Disable Time OEBn to B Waveform 1, 2 3.5 14 ns 9
3.5 13 ns 10
3.5 16 ns 11

5.9 Pi Bus Transceiver DS1776 AC Parameters: Setup / Hold / Pulse Width Specifications

The following conditions apply, unless otherwise specified. VCC = 5V ±10%
SYMBOL PARAMETER CONDITIONS NOTES MIN MAX UNIT SUB- GROUPS
tS A to LE Setup Waveform 5 7.0 ns 9, 10, 11
tH A to LE Hold Waveform 5 0.0 ns 9, 10, 11
tW LE Pulse Width Low Waveform 5 12 ns 9, 10, 11
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For specified specifications and test conditions, see the Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
(3) Tested Go-No-Go
(4) Same as VOH test.
(5) Same as VOL test.
(6) Not more than one output should be shorted at a time. For testing IOS, the use of high speed test apparatus and/or sample-and-hold techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting of a High output may raise the chip temperature above normal and thereby cause invalid readings in other parameter tests. In any sequence of parameter test, IOS tests should be performed last.
DS1776QML 20164205.pngFigure 1. Propagation Delay For Data To Output
DS1776QML 20164206.pngFigure 2. Propagation Delay For Data To Output
DS1776QML 20164207.pngFigure 3. TRI-STATE Output Enable Time
To High Level And Output Disable
Time From High Level
DS1776QML 20164208.pngFigure 4. TRI-STATE Output Enable Time
To Low Level And Output Disable
Time From Low Level
DS1776QML 20164209.png
The shaded areas indicate when the input is permitted to change for predictable output performance.


Figure 5. Data Setup And Hold Times And Le Pulse Widths

5.10 Test Circuit And Waveforms

5.10.1 Test Circuit For TRI-STATE Outputs On A Side

DS1776QML 20164210.png

Table 2. Switch Position

Test Switch
tPLZ, tPZL Closed
All Other Open

5.10.2 Test Circuit For TRI-STATE Outputs On B Side

DS1776QML 20164212.png
DEFINITIONS

RL = Load resistor 500Ω

CL = Load capacitance includes jig and probe capacitance

RT = Termination resistance should be equal to ZO of pulse generators.

RU = Pull up resistor

5.10.3 Input Pulse Definition

DS1776QML 20164211.png
Input Pulse Characteristics
Amplitude Low V Rep. Rate tW tTLH tTHL
A Side 3.0V 0.0V 1 MHz 500 ns 2 ns 2 ns
B Side 2.0V 1.0V 1 MHz 500 ns 2 ns 2 ns