SNLS144K June 2005 – March 2024 DS40MB200
PRODUCTION DATA
The supply (VCC) and ground (GND) pins must be connected to power planes routed on adjacent layers of the printed circuit board. The layer thickness of the dielectric must be minimized so that the VCC and GND planes create a low inductance supply with distributed capacitance. Careful attention to supply bypassing through the proper use of bypass capacitors is required. A 0.01-μF or 0.1-μF bypass capacitor must be connected to each VCC pin such that the capacitor is placed as close to the VCC pins as possible. Smaller body-size capacitors, such as 0402 body size, can help facilitate proper component placement. Refer to the VCC pin connections in Figure 8-2 for further details.