SNLS144K June   2005  – March 2024 DS40MB200

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Ratings
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 CML Inputs and EQ
      2. 7.3.2 Multiplexer and Loopback Control
      3. 7.3.3 CML Drivers and Pre-Emphasis Control
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.2 Layout Examples

Stencil parameters such as aperture area ratio and the fabrication process have a significant impact on paste deposition. Inspection of the stencil prior to placement of the WQFN package is highly recommended to improve board assembly yields. If the via and aperture openings are not carefully monitored, the solder may flow unevenly through the DAP. Stencil parameters for aperture opening and via locations are shown in Figure 10-1. A layout example for the DS40MB200 DAP is shown in Figure 10-2, where 16 stencil openings are used for the DAP alongside nine vias to GND.

DS40MB200 No Pullback WQFN, Single Row Reference DiagramFigure 10-1 No Pullback WQFN, Single Row Reference Diagram
Table 10-1 No Pullback WQFN Stencil Aperture Summary for DS40MB200
DEVICEPIN COUNTMKT DWGPCB I/O PAD SIZE (mm)PCB PITCH (mm)PCB DAP SIZE (mm)STENCIL I/O APERTURE (mm)STENCIL DAP APERTURE (mm)NUMBER
OF DAP
APERTURE OPENINGS		GAP BETWEEN DAP APERTURE
(Dim A mm)
DS40MB20048SQA48A0.25 × 0.60.55.1 × 5.10.25 × 0.71.1 × 1.1160.2
DS40MB200 48-Pin WQFN Stencil Example of Via and Opening PlacementFigure 10-2 48-Pin WQFN Stencil Example of Via and Opening Placement