SNLS401C February   2012  – September 2018 DS90C187

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
      2.      Typical Application
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     DS90C187 Pin Descriptions — Serializer
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Recommended Input Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 AC Timing Diagrams
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Device Functional Modes
      1. 8.3.1  Device Configuration
      2. 8.3.2  Single Pixel Input / Single Pixel Output
      3. 8.3.3  Single Pixel Input / Dual Pixel Output
      4. 8.3.4  Dual Pixel Input / Dual Pixel Output
      5. 8.3.5  Pixel Clock Edge Select (RFB)
      6. 8.3.6  Power Management
      7. 8.3.7  Sleep Mode (PDB)
      8. 8.3.8  LVDS Outputs
      9. 8.3.9  18 bit / 24 bit Color Mode (18B)
      10. 8.3.10 LVCMOS Inputs
    4. 8.4 Programming
      1. 8.4.1 LVDS Interface / TFT Color Data Recommended Mapping
        1. 8.4.1.1 Color Mapping Information
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 LVDS Interconnect Guidelines
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Up Sequence
    2. 10.2 Power Supply Filtering
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2.1 LVDS Interconnect Guidelines

Refer to the AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines (SNLA008) and Transmission Line RAPIDESIGNER Operation and Applications Guide (SNLA035) for full details.

  • Use 100-Ω coupled differential pairs
  • Use differential connectors when above 500 Mbps
  • Minimize skew within the pair
  • Use the S/2S/3S rule in spacings
    • S = space between the pairs
    • 2S = space between pairs
    • 3S = space to LVCMOS signals
  • Place ground vias next to signal vias when changing between layers
  • When a signal changes reference planes, place a bypass cap and vias between the new and old reference plane

For more tips and detailed suggestions regarding high speed board layout principles, see the LVDS Owner's Manual at http://www.ti.com/lvds