SNLS498A November   2015  – December 2015 DS90CR286AT-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LVDS Receivers
        1. 7.3.1.1 Input Termination
      2. 7.3.2 Phase Locked Loop (PLL)
      3. 7.3.3 Serial LVDS-to-Parallel LVCMOS Converter
      4. 7.3.4 LVCMOS Drivers
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Bit Resolution and Operating Frequency Compatibility
        2. 8.2.2.2 Data Mapping between Receiver and Endpoint Panel Display
        3. 8.2.2.3 RSKM Interoperability
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

Proper power supply decoupling is important to ensure a stable power supply with minimal power supply noise. Bypassing capacitors are needed to reduce the impact of switching noise which could limit performance. For a conservative approach, three parallel-connected decoupling capacitors (Multi-Layered Ceramic type in surface mount form factor) between each VCC and the ground plane(s) are recommended. The three capacitor values are 0.1 μF, 0.01 μF and 0.001 μF. The preferred capacitor size is 0402. An example is shown in Figure 28. The designer should place bypass capacitors as close as possible to the VCC pins and ensure each capacitor has its own via to connect the ground plane. If board space is limiting the number of bypass capacitors, the PLL VCC should receive the most filtering or bypassing. Next would be the LVDS VCC pins and finally the logic VCC pins.

DS90CR286AT-Q1 01291025.png Figure 28. Recommended Bypass Capacitor Decoupling Configuration