SNLS141E August   2002  – March 2024 DS90LT012A , DS90LV012A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Electrical Characteristics
    4. 4.4 Switching Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Feature Description
      1. 6.2.1 Termination
      2. 6.2.2 Threshold
      3. 6.2.3 Fail-Safe Feature
      4. 6.2.4 Probing LVDS Transmission Lines
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Differential Traces
    3. 9.3 Cables and Connectors, General Comments
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1 Layout Guidelines

Use at least 4 PCB board layers (top to bottom): LVDS signals, ground, power, TTL signals.

Isolate TTL signals from LVDS signals, otherwise the TTL signals may couple onto the LVDS lines. It is best to put TTL and LVDS signals on different layers which are isolated by a power/ground plane(s).

Keep drivers and receivers as close to the (LVDS port side) connectors as possible.

For PC board considerations for the WSON package, please refer to application note AN-1187 “Leadless Leadframe Package” (SNOA401). It is important to note that to optimize signal integrity (minimize jitter and noise coupling), the WSON thermal land pad, which is a metal (normally copper) rectangular region located under the package, should be attached to ground and match the dimensions of the exposed pad on the PCB (1:1 ratio).