SNLS420D July   2012  – July 2015 DS90UB913Q-Q1 , DS90UB914Q-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description continued
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics
    6. 8.6  Timing Requirements: Recommended for Serializer PCLK
    7. 8.7  AC Timing Specifications (SCL, SDA) - I2C Compliant
    8. 8.8  Bidirectional Control Bus DC Timing Specifications (SCL, SDA) - I2C Compliant
    9. 8.9  Switching Characteristics: Serializer
    10. 8.10 Switching Characteristics: Deserializer
    11. 8.11 Typical Characteristics
  9. 9 Parameter Measurement Information
    1. 9.1 AC Timing Diagrams and Test Circuits
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Serial Frame Format
      2. 10.3.2  Line Rate Calculations for the DS90UB91xQ
      3. 10.3.3  Deserializer Multiplexer Input
      4. 10.3.4  Error Detection
      5. 10.3.5  Description of Bidirectional Control Bus and I2C Modes
      6. 10.3.6  Slave Clock Stretching
      7. 10.3.7  I2C Pass-Through
      8. 10.3.8  ID[x] Address Decoder on the Serializer
      9. 10.3.9  ID[x] Address Decoder on the Deserializer
      10. 10.3.10 Programmable Controller
      11. 10.3.11 Synchronizing Multiple Cameras
      12. 10.3.12 General-Purpose I/O (GPIO) Descriptions
      13. 10.3.13 LVCMOS VDDIO Option
      14. 10.3.14 Deserializer - Adaptive Input Equalization (AEQ)
      15. 10.3.15 EMI Reduction
        1. 10.3.15.1 Deserializer Staggered Output
        2. 10.3.15.2 Spread Spectrum Clock Generation (SSCG) on the Deserializer
    4. 10.4 Device Functional Modes
      1. 10.4.1  DS90UB91xQ-Q1 Operation With External Oscillator as Reference Clock
      2. 10.4.2  DS90UB91xQ-Q1 Operation With Pixel Clock from Imager as Reference Clock
      3. 10.4.3  MODE Pin on Serializer
      4. 10.4.4  MODE Pin on Deserializer
      5. 10.4.5  Clock-Data Recovery Status Flag (LOCK), Output Enable (OEN) and Output State Select (OSS_SEL)
      6. 10.4.6  Multiple Device Addressing
      7. 10.4.7  Powerdown
      8. 10.4.8  Pixel Clock Edge Select (TRFB / RRFB)
      9. 10.4.9  Power-Up Requirements and PDB Pin
      10. 10.4.10 Built-In Self Test
      11. 10.4.11 BIST Configuration and Status
        1. 10.4.11.1 Sample BIST Sequence
    5. 10.5 Register Maps
  11. 11Application and Implementation
    1. 11.1 Applications Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 Transmission Media
        2. 11.2.1.2 Adaptive Equalizer - Loss Compensation
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curve
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Related Links
    3. 14.3 Community Resources
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RTV|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)(3)(2)
MIN MAX UNIT
Supply voltage – VDDn (1.8 V) −0.3 2.5 V
Supply voltage – VDDIO −0.3 4.0 V
LVCMOS input voltage −0.3 VDDIO + 0.3 V
CML driver I/O voltage (VDD) −0.3 VDD + 0.3 V
CML receiver I/O voltage (VDD) −0.3 VDD + 0.3 V
Junction temperature 150 °C
Maximum package power dissipation capacity package 1/θJA above +25° °C/W
Air discharge (DOUT+, DOUT–, RIN+, RIN–) −25 25 kV
Contact discharge (DOUT+, DOUT–, RIN+, RIN–) −7 7 kV
Storage temperature Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For soldering specifications: see product folder at www.ti.com and SNOA549.
(3) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.

8.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) ±8000 V
Charged-device model (CDM), per AEC Q100-011 ±1000
Machine model (MM) ±250
IEC 61000-4-2(2) Air Discharge (DOUT+, DOUT-, RIN+, RIN-) ≥±25 000
Contact Discharge (DOUT+, DOUT-, RIN+, RIN-) ≥±7000
ISO10605(3)(4) Air Discharge ≥±15 000
Contact Discharge ≥±8000
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
(2) RD = 330 Ω, CS = 150 pF
(3) RD = 330 Ω, CS = 150 / 330 pF
(4) RD = 2 KΩ, CS = 150 / 330 pF

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage (VDDn) 1.71 1.8 1.89 V
LVCMOS supply voltage (VDDIO) OR 1.71 1.8 1.89 V
LVCMOS supply voltage (VDDIO) OR 3.0 3.3 3.6
LVCMOS supply voltage (VDDIO) only serializer 2.52 2.8 3.08
Supply noise(1)     VDDn (1.8 V) 25 mVp-p
VDDIO (1.8 V) 25
VDDIO (3.3 V) 50
Operating free-air temperature (TA) –40 25 105 °C
PCLK clock frequency 10 100 MHz
(1) Supply noise testing was done with minimum capacitors (as shown on Figure 49 and Figure 48) on the PCB. A sinusoidal signal is AC coupled to the VDDn (1.8-V) supply with amplitude = 25 mVp-p measured at the device VDDn pins. Bit error rate testing of input to the serializer and output of the deserializer with 10 meter cable shows no error when the noise frequency on the serializer is less than
1 MHz. The deserializer on the other hand shows no error when the noise frequency is less than 750 kHz.

8.4 Thermal Information

THERMAL METRIC(1) DS90UB913Q-Q1 DS90UB914Q-Q1 UNIT
RTV (WQFN) RHS (WQFN)
32 PINS 48 PINS
RθJA Junction-to-ambient thermal resistance 38.4 26.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 6.9 4.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

8.5 Electrical Characteristics

over recommended operating supply and temperature ranges unless otherwise specified.(1)(2)(3)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
LVCMOS DC SPECIFICATIONS 3.3V I/O (SERIALIZER INPUTS, DESERIALIZER OUTPUTS, GPI, GPO, CONTROL INPUTS AND OUTPUTS)
VIH High level input voltage VIN = 3 V to 3.6 V 2 VIN V
VIL Low level input voltage VIN = 3 V to 3.6 V GND 0.8 V
IIN Input current VIN = 0 V or 3.6 V, VIN = 3 V to 3.6 V −20 ±1 20 µA
VOH High level output voltage VDDIO = 3 V to 3.6 V, IOH = −4 mA 2.4 VDDIO V
VOL Low level output voltage VDDIO = 3 V to 3.6 V, IOL = +4 mA GND 0.4 V
IOS Output short circuit current VOUT = 0 V Serializer
GPO outputs		 –15 mA
Deserializer LVCMOS outputs –35
IOZ TRI-STATE output current PDB = 0 V,
VOUT = 0 V or VDD 		LVCMOS outputs –20 20 µA
LVCMOS DC SPECIFICATIONS 1.8V I/O (SERIALIZER INPUTS, DESERIALIZER OUTPUTS, GPI, GPO, CONTROL INPUTS AND OUTPUTS)
VIH High level input voltage VIN = 1.71 V to 1.89 V 0.65 VIN VIN V
VIL Low level input voltage VIN = 1.71 V to 1.89 V GND 0.35 VIN
IIN Input current VIN = 0 V or 1.89 V, VIN = 1.71 V to 1.89 V –20 ±1 20 µA
VOH High level output voltage VDDIO = 1.71 V to 1.89 V, IOH = −4 mA VDDIO – 0.45 VDDIO V
VOL Low level output voltage VDDIO = 1.71 V to 1.89 V
IOL = 4 mA 		Deserializer LVCMOS outputs GND 0.45 V
IOS Output short circuit current VOUT = 0 V Serializer
GPO outputs		 –11 mA
Deserializer LVCMOS outputs –17
IOZ TRI-STATE output current PDB = 0 V,
VOUT = 0 V or VDD		 LVCMOS outputs –20 20 µA
LVCMOS DC SPECIFICATIONS 2.8-V I/O (SERIALIZER INPUTS, GPI, GPO, CONTROL INPUTS AND OUTPUTS)
VIH High level input voltage VIN = 2.52 V to 3.08 V 0.7 VIN VIN V
VIL Low level input voltage VIN = 2.52 V to 3.08 V GND 0.3 VIN
IIN Input current VIN = 0 V or 3.08 V, VIN = 2.52 V to 3.08 V −20 ±1 20 µA
VOH High level output voltage VDDIO = 2.52 V to 3.08 V, IOH = −4 mA VDDIO – 0.4 VDDIO V
VOL Low level output voltage VDDIO =2.52 V to 3.08 V
IOL = 4 mA 		Deserializer LVCMOS outputs GND 0.4 V
IOS Output short circuit current VOUT = 0 V Serializer
GPO outputs		 −11 mA
Deserializer LVCMOS outputs −20
IOZ TRI-STATE output current PDB = 0 V,
VOUT = 0 V or VDD		 LVCMOS outputs −20 20 µA
CML DRIVER DC SPECIFICATIONS (DOUT+, DOUT–)
|VOD| Output differential voltage RL = 100 Ω (see Figure 9) 268 340 412 mV
ΔVOD Output differential voltage unbalance RL = 100 Ω 1 50 mV
VOS Output differential
offset voltage		 RL = 100 Ω (see Figure 9) VDD – VOD/2 V
ΔVOS Offset voltage unbalance RL = 100 Ω 1 50 mV
IOS Output short
circuit current		 DOUT± = 0 V –26 mA
RT Differential internal termination resistance Differential across DOUT+ and DOUT– 80 100 120 Ω
CML RECEIVER DC SPECIFICATIONS (RIN0+, RIN0–, RIN1+, RIN1– )
IIN Input current VIN = VDD or 0 V, VDD = 1.89 V −20 1 20 µA
RT Differential internal termination resistance Differential across RIN+ and RIN- 80 100 120 Ω
CML RECEIVER AC SPECIFICATIONS (RIN0+, RIN0–, RIN1+, RIN1– )
|Vswing| Minimum allowable swing for 1010 pattern(4) Line rate = 1.4 Gbps (see Figure 11) 135 mV
CML MONITOR OUTPUT DRIVER SPECIFICATIONS (CMLOUTP, CMLOUTN)
Ew Differential output
eye opening		 RL = 100 Ω
Jitter frequency > f / 40 (see Figure 20)		 0.45 UI
EH Differential output
eye height		 200 mV
SERIALIZER AND DESERIALIZER SUPPLY CURRENT *DIGITAL, PLL, AND ANALOG VDD
IDDT Serializer (TX)
VDDn supply current (includes load current) 		RL = 100 Ω
WORST CASE pattern (see Figure 6)		 VDDn = 1.89 V
VDDIO = 3.6 V
f = 100 MHz,
10-bit mode
default registers 		61 80 mA
VDDn = 1.89 V
VDDIO = 3.6 V
f = 75 MHz,
12-bit high-frequency mode
default registers		 61 80 mA
VDDn = 1.89 V
VDDIO = 3.6 V
f = 50 MHz,
12-bit low-frequency mode
default registers		 61 80
RL = 100 Ω
RANDOM PRBS-7 pattern		 VDDn = 1.89 V
VDDIO = 3.6 V
f = 100 MHz,
10-bit mode
default registers 		54 mA
VDDn = 1.89 V
VDDIO = 3.6 V
f = 75 MHz,
12-bit high-frequency mode
default registers		 54
VDD = 1.89 V
VDDIO = 3.6 V
f = 50 MHz,
12-bit low-frequency mode
default registers		 54
IDDIOT Serializer (TX)
VDDIO supply current (includes load current) 		RL = 100 Ω
WORST CASE pattern (see Figure 6)		 VDDIO = 1.89 V
f = 75 MHz,
12-bit high-freq mode
default registers		 1.5 3 mA
VDDIO = 3.6 V
f = 75 MHz,
12-bit high-frequency
mode default registers		 5 8
IDDTZ Serializer (TX) supply current power-down PDB = 0 V; all other LVCMOS inputs = 0 V VDDIO = 1.89 V
Default registers		 300 900 µA
VDDIO = 3.6 V
Default registers		 300 900 µA
IDDIOTZ Serializer (TX) VDDIO supply current power-down PDB = 0 V; All other LVCMOS Inputs = 0 V VDDIO = 1.89 V
Default registers		 15 100 µA
VDDIO = 3.6 V
Default registers		 15 100 µA
IDDIOR Deserializer (RX) total supply current (includes load current) VDDIO = 1.89 V
CL = 8 pF
WORST CASE pattern		 f = 100 MHz, 10-bit mode 22 42 mA
f = 75 MHz, 12-bit high-freq mode 19 39
f = 50 MHz, 12-bit low-freq mode 21 32
VDDIO = 1.89 V
CL=8pF
Random pattern		 f = 100 MHz, 10–bit mode 15 mA
f = 75 MHz, 12-bit high-freq mode 12
f = 50 MHz, 12-bit low-freq mode 14
VDDIO = 3.6 V
CL = 8 pF
WORST CASE pattern		 f = 100 MHz, 10-bit mode 42 55 mA
f = 75 MHz, 12-bit high-freq mode 37 50
f = 50 MHz, 12-bit low-freq mode 25 38
VDDIO = 3.6 V
CL = 8 pF
Random pattern		 f = 100 MHz, 10-bit mode 35 mA
f = 75 MHz, 12-bit high-freq mode 30
f = 50 MHz, 12-bit low-freq mode 18
VDDIO = 1.89 V
CL = 4 pF
WORST CASE pattern		 f = 100 MHz, 10-bit mode 15 mA
f = 75 MHz, 12-bit high-freq mode 11
f = 50 MHz, 12-bit low-freq mode 16
VDDIO = 1.89 V
CL = 4 pF
Random pattern		 f = 100 MHz, 10-bit mode 8 mA
f = 75 MHz, 12-bit high-freq mode 4
f = 50 MHz, 12-bit low-freq mode 9
VDDIO = 3.6 V
CL = 4 pF
WORST CASE pattern		 f = 100 MHz, 10-bit mode 36 mA
f = 75 MHz, 12-bit high-freq mode 29
f = 50 MHz, 12-bit low-freq mode 20
VDDIO = 3.6 V
CL = 4 pF
Random pattern		 f = 100 MHz, 10-bit mode 29 mA
f = 75 MHz, 12-bit high-freq mode 22
f = 50 MHz, 12-bit low-freq mode 13
IDDR Deserializer (RX) VDDn supply current (includes load current) VDDn = 1.89 V
CL = 4 pF
WORST CASE pattern		 f = 100 MHz,
10-bit mode		 64 110 mA
f = 75 MHz,
12-bit high-frequency mode		 67 114
f = 50 MHz,
12-bit low-frequency mode		 63 96
VDDn = 1.89 V
CL = 4 pF
Random pattern		 f = 100 MHz,
10-bit mode		 57
f = 75 MHz, 12–bit
high-frequency mode		 60
f = 50 MHz, 12-bit
low-frequency mode		 56
IDDRZ Deserializer (RX) supply current power-down PBB = 0 V, all other LVCMOS Inputs=0 V VDDIO = 1.89 V
Default registers		 42 400 µA
PBB = 0 V, all other LVCMOS Inputs=0 V VDDIO = 3.6 V
Default registers		 42 400
IDDIORZ Deserializer (RX)
VDD supply current power-down		 PDB = 0 V, all other LVCMOS Inputs = 0 V VDDIO = 1.89 V 8 40 µA
VDDIO = 3.6 V 360 800
(1) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not ensured.
(2) Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground except VOD, ΔVOD, VTH and VTL which are differential voltages.
(3) Typical values represent most likely parametric norms at 1.8 V or 3.3 V, TA = 25°C, and at the Recommended Operation Conditions at the time of product characterization and are not specified.
(4) Specification is ensured by characterization and is not tested in production.

8.6 Timing Requirements: Recommended for Serializer PCLK

over recommended operating supply and temperature ranges unless otherwise specified.(1)
TEST CONDITIONS PIN/FREQ MIN NOM MAX UNIT
tTCP Transmit clock period 10-bit mode 10 T 50 ns
12-bit high-frequency mode 13.33 T 66.66
12-bit low-frequency mode 20 T 100
tTCIH Transmit clock
input high time		 0.4T 0.5T 0.6T ns
tTCIL Transmit clock
input low time		 0.4T 0.5T 0.6T ns
tCLKT PCLK input transition time (Figure 12) 20 MHz–100 MHz,
10-bit mode		 0.5T 2.5T 0.3T ns
15 MHz to 75 MHz, 12-bit high-frequency mode 0.5T 2.5T 0.3T
10 MHz to 50 MHz, 12-bit low-frequency mode 0.5T 2.5T 0.3T
tJIT0 PCLK input jitter
(PCLK from imager mode)		 Refer to jitter freq > f / 40 f = 10 to 100 MHz 0.1T ns
tJIT1 PCLK input jitter (external oscillator mode) Refer to jitter freq > f / 40 f = 10 to 100 MHz 1T ns
tJIT2 External oscillator jitter 0.1 UI
(1) Recommended input timing requirements are input specifications and not tested in production.

8.7 AC Timing Specifications (SCL, SDA) - I2C Compliant

over recommended supply and temperature ranges unless otherwise specified. (See Figure 5)
TEST CONDITIONS MIN NOM MAX UNIT
RECOMMENDED INPUT TIMING REQUIREMENTS
fSCL SCL clock frequency Standard mode >0 100 kHz
Fast mode >0 400
tLOW SCL low period Standard mode 4.7 µs
Fast mode 1.3
tHIGH SCL high period Standard mode 4.0 µs
Fast mode 0.6
tHD:STA Hold time for a start or a repeated start condition Standard mode 4 µs
Fast mode 0.6
tSU:STA Setup time for a start or a repeated start condition Standard mode 4.7 µs
Fast mode 0.6
tHD:DAT Data hold time Standard mode 0 3.45 µs
Fast mode 0 900
tSU:DAT Data setup time Standard mode 250 ns
Fast mode 100
tSU:STO Setup time for STOP condition Standard mode 4 µs
Fast mode 0.6
tBUF Bus free time between stop and start Standard mode 4.7 µs
Fast mode 1.3
tr SCL and SDA rise time Standard mode 1000 ns
Fast mode 300
tf SCL and SDA fall time Standard mode 300 ns
Fast mode 300

8.8 Bidirectional Control Bus DC Timing Specifications (SCL, SDA) - I2C Compliant

over recommended supply and temperature ranges unless otherwise specified(1)
TEST CONDITIONS MIN NOM MAX UNIT
RECOMMENDED INPUT TIMING REQUIREMENTS
VIH Input high level SDA and SCL 0.7 × VDDIO VDDIO V
VIL Input low level SDA and SCL GND 0.3 × VDDIO V
VHY Input hysteresis >50 mV
VOL Output low level SDA, IOL = 0.5 mA 0 0.4 V
IIN Input current SDA or SCL, VIN = VDDOP OR GND −10 10 µA
tR SDA rise time-READ SDA, RPU = 10 kΩ, Cb ≤ 400 pF (see Figure 5) 430 ns
tF SDA fall time-READ 20 ns
tSU;DAT See Figure 5 560 ns
tHD;DAT See Figure 5 615 ns
tSP 50 ns
CIN SDA or SCL <5 pF
(1) Specification is ensured by design.

8.9 Switching Characteristics: Serializer

over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tLHT CML low-to-high transition time RL = 100 Ω (see Figure 7) 150 330 ps
tHLT CML high-to-low transition time RL = 100 Ω (see Figure 7) 150 330 ps
tDIS Data input setup to PCLK Serializer data inputs (see Figure 13) 2 ns
tDIH Data input hold from PCLK 2 ns
tPLD Serializer PLL lock time RL = 100 Ω(1)(2), (see Figure 14) 1 2 ms
tSD Serializer delay(2) RT = 100 Ω, 10-bit mode
Register 0x03h b[0] (TRFB = 1) (see Figure 15)		 32.5T 38T 44T ns
RT = 100 Ω, 12-bit mode
Register 0x03h b[0] (TRFB = 1) (see Figure 15)		 11.75T 13T 15T
tJIND Serializer output deterministic jitter Serializer output intrinsic deterministic jitter. Measured (cycle-cycle) with PRBS-7 test pattern(3)(4) 0.13 UI
tJINR Serializer output
random jitter 		Serializer output intrinsic random jitter (cycle-cycle). Alternating-1,0 pattern.(3)(4) 0.04 UI
tJINT Peak-to-peak serializer output jitter Serializer output peak-to-peak jitter includes deterministic jitter, random jitter, and jitter transfer from serializer input. Measured (cycle-cycle) with PRBS-7 test pattern.(3)(4) 0.396 UI
λSTXBW Serializer jitter
transfer function –3-dB bandwidth(5)		 PCLK = 100 MHz
10-bit mode. Default registers
 2.2 MHz
PCLK = 75 MHz
12-bit high-frequency mode. Default registers
 2.2
PCLK = 50 MHz
12-bit low-frequency mode. Default registers
 2.2
δSTX Serializer jitter
transfer function
(peaking)(5)		 PCLK = 100 MHz
10-bit mode. Default Registers
 1.06 dB
PCLK = 75 MHz
12-bit high-frequency mode. Default registers
 1.09
PCLK = 50 MHz
12-bit low-frequency mode. Default registers
 1.16
δSTXf Serializer jitter
transfer function
(peaking frequency)(5)		 PCLK = 100 MHz
10-bit mode. Default registers
 400 kHz
PCLK = 75 MHz
12-bit high-frequency mode. Default registers
 500
PCLK = 50 MHz
12-bit low-frequency mode. Default registers
 600
(1) tPLD and tDDLT is the time required by the serializer and deserializer to obtain lock when exiting power-down state with an active PCLK
(2) Specification is ensured by design.
(3) Typical values represent most likely parametric norms at 1.8 V or 3.3 V, TA = 25°C, and at the recommended operation conditions at the time of product characterization and are not specified.
(4) UI – Unit Interval is equivalent to one ideal serialized data bit width. The UI scales with PCLK frequency.
(5) Specification is ensured by characterization and is not tested in production.

8.10 Switching Characteristics: Deserializer

over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER TEST CONDITIONS PIN/FREQ MIN TYP MAX UNIT
tRCP Receiver output
clock period		 10-bit mode PCLK (see Figure 19) 10 50 ns
12-bit high-frequency mode 13.33 66.66
12-bit low-frequency mode 10 100
tPDC PCLK duty cycle 10-bit mode PCLK 45% 50% 55%
12-bit high-frequency mode 40% 50% 60%
12-bit low-frequency mode 40% 50% 60%
tCLH LVCMOS low-to-high transition time VDDIO: 1.71 V to 1.89 V or 3.0 V to 3.6 V,
CL = 8 pF (lumped load)
Default registers
(see Figure 17)(1)		 PCLK 1.3 2 2.8 ns
tCHL LVCMOS high-to-low transition time 1.3 2 2.8 ns
tCLH LVCMOS low-to-high transition time VDDIO: 1.71 V to 1.89 V or 3.0 V to 3.6 V,
CL = 8 pF (lumped load)
Default registers
(see Figure 17)(1)		 ROUT[11:0], HS, VS 1 2.5 4 ns
tCHL LVCMOS high-to-low transition time 1 2.5 4 ns
tROS ROUT setup data to PCLK

VDDIO: 1.71 V to 1.89 V or 3.0 V to 3.6 V,
CL = 8 pF (lumped load)
Default registers (see Figure 19)		 ROUT[11:0], HS, VS 0.38T 0.5T ns
tROH ROUT hold data to PCLK 0.38T 0.5T ns
tDD Deserializer delay Default registers
Register 0x03h b[0] (RRFB = 1)
(see Figure 18)(1)		 10-bit mode 154T 158T ns
12-bit low-frequency mode 109T 112T
12-bit high-frequency mode 73T 75T
tDDLT Deserializer data lock time With Adaptive Equalization (see Figure 16) 10-bit mode 15 22 ms
12-bit low-frequency mode 15 22
12-bit high-frequency mode 15 22
tRCJ Receiver clock jitter PCLK
SSCG[3:0] = OFF(1)		 10-bit mode
PCLK = 100 MHz		 20 30 ps
12-bit low-frequency mode
PCLK = 50 MHz		 22 35
12-bit high-frequency mode
PCLK = 75 MHz		 45 90
tDPJ Deserializer period jitter PCLK
SSCG[3:0] = OFF(1)(2)		 10-bit mode
PCLK = 100 MHz		 170 815 ps
12-bit low-frequency mode
PCLK= 50 MHz		 180 330
12-bit high-frequency mode
PCLK= 75 MHz		 300 515
tDCCJ Deserializer cycle-to-cycle clock jitter PCLK
SSCG[3:0] = OFF(1)(3)		 10-bit mode
PCLK = 100 MHz		 440 1760 ps
12-bit low-frequency mode
PCLK = 50 MHz		 460 730
12-bit high-frequency mode
PCLK = 75 MHz		 565 985
fdev Spread spectrum clocking deviation frequency LVCMOS output bus
SSC[3:0] = ON (see Figure 24)(1)		 10 MHz–100 MHz ±0.5 to ±1.5%
fmod Spread spectrum clocking modulation frequency 10 MHz–100 MHz 5 to 50 kHz
(1) Specification is ensured by characterization and is not tested in production.
(2) tDPJ is the maximum amount the period is allowed to deviate measured over 30,000 samples.
(3) tDCCJ is the maximum amount of jitter between adjacent clock cycles measured over 30,000 samples.

8.11 Typical Characteristics

DS90UB913Q-Q1 DS90UB914Q-Q1 30144688.gif
Figure 1. Typical Serializer Jitter Transfer Function
at 100 MHz
DS90UB913Q-Q1 DS90UB914Q-Q1 30144675.gif
Figure 3. Maximum Equalizer Gain vs. Line Frequency
DS90UB913Q-Q1 DS90UB914Q-Q1 30144659.gif
Figure 2. Typical Deserializer Input Jitter Tolerance Curve
at 1.4-Gbps Line Rate
DS90UB913Q-Q1 DS90UB914Q-Q1 30144687.gif
Figure 4. Adaptive Equalizer – Interconnect Loss Compensation