SLVSH16A February   2024  – March 2024 ESD2CAN36-Q1 , ESD2CANFD36-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings—AEC Specification
    3. 5.3 ESD Ratings—IEC Specification
    4. 5.4 ESD Ratings - ISO Specification
    5. 5.5 Recommended Operating Conditions
    6. 5.6 Thermal Information
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics – ESD2CAN36-Q1
    9. 5.9 Typical Characteristics- ESD2CANFD36-Q1
  7. 6Application and Implementation
    1. 6.1 Application Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBZ|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Thermal Information

THERMAL METRIC(1) ESD2CAN36-Q1 ESD2CANFD36-Q1 UNIT
DBZ (SOT-23) DBZ (SOT-23)
3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 293.4 313.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 148.9 162.8 °C/W
RθJB Junction-to-board thermal resistance 133.0 151.8 °C/W
ΨJT Junction-to-top characterization parameter 32.9 43.5 °C/W
ΨJB Junction-to-board characterization parameter 132.0 150.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.