SLVSH10C
November 2022 – December 2022
ESD751
,
ESD761
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings—JEDEC Specification
6.3
ESD Ratings—IEC Specification
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Typical Characteristics – ESD751
6.8
Typical Characteristics - ESD761
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
IEC 61000-4-5 Surge Protection
7.3.2
I/O Capacitance
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DYA|2
MPSS124A
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slvsh10c_oa
slvsh10c_pm
6.7
Typical Characteristics – ESD751
Figure 6-1
Positive TLP Curve
Figure 6-3
+8-kV Clamped IEC Waveform
Figure 6-5
Capacitance vs. Bias Voltage
Figure 6-2
Negative TLP Curve
Figure 6-4
-8-kV Clamped IEC Waveform
Figure 6-6
Leakage Current vs. Temperature