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ESD751

ACTIVE

1.6-pF ±24-V ±22-kV ESD protection diode for USB power delivery

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Data sheet

ESD751

ACTIVE
Data sheet Order now

Product details

Package name SOD523 (SOT-5X3) Peak pulse power (8/20 μs) (max) (W) 102 Vrwm (V) 24 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 1.6 IEC 61000-4-2 contact (±V) 22000 IEC 61000-4-5 (A) 2.8 Features ESD Protection Clamping voltage (V) 36.5 Dynamic resistance (typ) 0.6 Interface type LIN Breakdown voltage (min) (V) 25.5 IO leakage current (max) (nA) 50 Rating Catalog Operating temperature range (°C) -55 to 150
Package name SOD523 (SOT-5X3) Peak pulse power (8/20 μs) (max) (W) 102 Vrwm (V) 24 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 1.6 IEC 61000-4-2 contact (±V) 22000 IEC 61000-4-5 (A) 2.8 Features ESD Protection Clamping voltage (V) 36.5 Dynamic resistance (typ) 0.6 Interface type LIN Breakdown voltage (min) (V) 25.5 IO leakage current (max) (nA) 50 Rating Catalog Operating temperature range (°C) -55 to 150
SOT-5X3 (DYA) 2 1.28 mm² 1.6 x 0.8
  • IEC 61000-4-2 level 4 ESD protection:
    • ±22-kV or ±15-kV contact discharge
    • ±22-kV or ±15-kV air-gap discharge
  • Robust surge protection:
    • IEC 61000-4-5 (8/20 µs): 2.8 A or 1.8 A
  • 24-V working voltage
  • Bidirectional ESD protection
  • Low clamping voltage protects downstream components
  • Temperature range: –55°C to +150°C
  • I/O capacitance = 1.6 pF or 1.1 pF (typical)
  • Offered in a standard leaded package and 0402 footprint package: SOD-523 (DYA) and X1SON (DPY)
  • Leaded packages used for automatic optical inspection (AOI)
  • IEC 61000-4-2 level 4 ESD protection:
    • ±22-kV or ±15-kV contact discharge
    • ±22-kV or ±15-kV air-gap discharge
  • Robust surge protection:
    • IEC 61000-4-5 (8/20 µs): 2.8 A or 1.8 A
  • 24-V working voltage
  • Bidirectional ESD protection
  • Low clamping voltage protects downstream components
  • Temperature range: –55°C to +150°C
  • I/O capacitance = 1.6 pF or 1.1 pF (typical)
  • Offered in a standard leaded package and 0402 footprint package: SOD-523 (DYA) and X1SON (DPY)
  • Leaded packages used for automatic optical inspection (AOI)

The ESD751 and ESD761 are single-channel low capacitance bidirectional ESD protection devices for USB power delivery (USB-PD). These devices are rated to dissipate contact ESD strikes beyond the maximum level specified in the IEC 61000-4-2 international standard (±22-kV Contact, ±22-kV Airgap) and (±15-kV Contact, ±15-kV Airgap), respectively. The low dynamic resistance and low clamping voltage help protect systems against transient events. This protection is key because industrial systems require a high level of robustness and reliability.

The ESD751 and ESD761 are single-channel low capacitance bidirectional ESD protection devices for USB power delivery (USB-PD). These devices are rated to dissipate contact ESD strikes beyond the maximum level specified in the IEC 61000-4-2 international standard (±22-kV Contact, ±22-kV Airgap) and (±15-kV Contact, ±15-kV Airgap), respectively. The low dynamic resistance and low clamping voltage help protect systems against transient events. This protection is key because industrial systems require a high level of robustness and reliability.
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Technical documentation

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Type Title Date
* Data sheet ESD751 and ESD761 24-V 1-Channel ESD Protection Diodes datasheet (Rev. C) PDF | HTML 15 Dec 2022
Application note ESD and Surge Protection for USB Interfaces (Rev. B) PDF | HTML 11 Jan 2024
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 18 Aug 2022
Analog Design Journal Design Considerations for System-Level ESD Circuit Protection 25 Sep 2012

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

ESDEVM — ESD evaluation module

The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested. For typical (...)
User guide: PDF | HTML
Not available on TI.com
Package Pins CAD symbols, footprints & 3D models
SOT-5X3 (DYA) 2 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

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