SLVSGX0B
May 2022 – November 2022
ESD752
,
ESD762
PRODMIX
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings—JEDEC Specification
6.3
ESD Ratings—IEC Specification
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Typical Characteristics – ESD752
6.8
Typical Characteristics – ESD762
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Temperature Range
7.3.2
IEC 61000-4-5 Surge Protection
7.3.3
IO Capacitance
7.3.4
Dynamic Resistance
7.3.5
DC Breakdown Voltage
7.3.6
Ultra Low Leakage Current
7.3.7
Clamping Voltage
7.3.8
Industry Standard Leaded Packages
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DBZ|3
MPDS108F
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slvsgx0b_oa
slvsgx0b_pm
6.8
Typical Characteristics – ESD762
Figure 6-8
+8-kV Clamped IEC Waveform
Figure 6-9
−8-kV Clamped IEC Waveform