SBOS437K May   2008  – November 2023 INA210 , INA211 , INA212 , INA213 , INA214 , INA215

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configurations and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Basic Connections
      2. 6.3.2 Selecting RS
    4. 6.4 Device Functional Modes
      1. 6.4.1 Input Filtering
      2. 6.4.2 Shutting Down the INA21x Series
      3. 6.4.3 REF Input Impedance Effects
      4. 6.4.4 Using The INA21x With Common-Mode Transients Above 26 V
      5. 6.4.5 Improving Transient Robustness
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Unidirectional Operation
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Bidirectional Operation
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curve
  9. Power Supply Recommendations
  10. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Related Links
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision J (February 2017) to Revision K (October 2023)

  • Updated format to match new TI layout and flow. Tables, figures and cross-references use a new numbering sequence throughout the document.Go

Changes from Revision I (September 2016) to Revision J (February 2017)

  • Added 2017 copyright to front page graphic Go
  • Deleted Device Options table Go
  • Added Common-mode analog inputs (Versions B and C) to Absolute Maximum Ratings tableGo
  • Changed HBM ESD value (Version A) from 4000 to 2000 V in ESD Ratings table Go
  • Changed formatting of Thermal Information table noteGo
  • Deleted static literature number from document reference in Related Documentation section Go

Changes from Revision H (June 2016) to Revision I (September 2016)

  • Deleted all notes regarding preview devices throughout data sheet; all devices now activeGo

Changes from Revision G (July 2014) to Revision H (June 2016)

  • Changed Features section: deleted last bullet, changed packages bullet Go
  • Deleted last Applications bullet Go
  • Changed Description sectionGo
  • Changed Device Information table Go
  • Moved storage temperature to Absolute Maximum Ratings table Go
  • Changed ESD Ratings table: changed title, changed format to current standards Go
  • Deleted both Machine Model rows from ESD Ratings table Go
  • Changed first sentence referencing Equation 1 in Input Filtering section: replaced seen with measured Go
  • Changed second sentence referencing Equation 1 in Input Filtering section Go
  • Corrected punctuation and added clarity to first and second paragraphs in Shutting Down the INA21x Series section Go
  • Changed impressed to present in fourth paragraph of Shutting Down the INA21x Series sectionGo

Changes from Revision F (June 2014) to Revision G (July 2014)

  • Changed Simplified Schematic: added equation below gain tableGo
  • Changed V(ESD) HBM specifications for version A in Handling Ratings tableGo

Changes from Revision E (June 2013) to Revision F (June 2014)

  • Changed format to meet latest data sheet standards; added Pin Functions, Recommended Operating Conditions, and Thermal Information tables, Overview, Functional Block Diagram, Application Information, Power Supply Recommendations, and Layout sections, and moved existing sectionsGo
  • Added INA215 to document Go
  • Added INA215 sub-bullet to fourth Features bullet Go
  • Added INA215 to simplified schematic table Go
  • Added Thermal Information tableGo
  • Added INA215 to Figure 5-7 Go
  • Added INA215 to Figure 5-15 Go
  • Added INA215 to Figure 6-3 Go

Changes from Revision D (November 2012) to Revision E (June 2013)

    Changes from Revision C (August 2012) to Revision D (November 2012)

    • Changed Frequency Response, Bandwidth parameter in Electrical Characteristics tableGo

    Changes from Revision B (June 2009) to Revision C (August 2012)

    • Added silicon version B row to Input, Common-Mode Input Range parameter in Electrical Characteristics tableGo
    • Added silicon version B ESD ratings to Abs Max tableGo
    • Corrected typo in Figure 5-9 Go
    • Updated Figure 5-12 Go
    • Changed Input Filtering sectionGo
    • Added Improving Transient Robustness sectionGo

    Changes from Revision A (June 2008) to Revision B ()

    • Added RSW package to device photoGo
    • Changed SC70 Package bullet of Features listGo
    • Added UQFN package to Features listGo
    • Updated front page graphicGo
    • Added RSW package pin out drawingGo
    • Added footnote 3 to Electrical Characteristics tableGo
    • Added UQFN package information to Temperature Range section of Electrical Characteristics tableGo
    • Changed Figure 5-2 to reflect operating temperature rangeGo
    • Changed Figure 5-4 to reflect operating temperature rangeGo
    • Changed Figure 5-6 to reflect operating temperature rangeGo
    • Changed Figure 5-13 to reflect operating temperature rangeGo
    • Changed Figure 5-14 to reflect operating temperature rangeGo
    • Added RSW description to the Basic Connections sectionGo
    • Changed 60 μV to 100 μV in last sentence of the Selecting RS sectionGo

    Changes from Revision * (May 2008) to Revision A ()