SBOS554C March   2012  – January 2021 INA282-Q1 , INA283-Q1 , INA284-Q1 , INA285-Q1 , INA286-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Selecting RS
      2. 7.3.2 Effective Bandwidth
      3. 7.3.3 Transient Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reference Pin Connection Options
        1. 7.4.1.1 Unidirectional Operation
          1. 7.4.1.1.1 Ground Referenced Output
          2. 7.4.1.1.2 V+ Referenced Output
        2. 7.4.1.2 Bidirectional Operation
          1. 7.4.1.2.1 External Reference Output
          2. 7.4.1.2.2 Splitting the Supply
          3. 7.4.1.2.3 Splitting an External Reference
      2. 7.4.2 Shutdown
      3. 7.4.3 Extended Negative Common-Mode Range
      4. 7.4.4 Calculating Total Error
        1. 7.4.4.1 Example 1 INA282-Q1
        2. 7.4.4.2 Example 2 INA286-Q1
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Connections
    2. 8.2 Typical Applications
      1. 8.2.1 Current Summing
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedures
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Current Differencing
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
  12. 12Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

Connect the input pins to the sensing resistor using a Kelvin or 4-wire connection. This connection technique makes sure that only the current-sensing resistor impedance is detected between the input pins. Poor routing of the current-sensing resistor commonly results in additional resistance present between the input pins. Given the very low ohmic value of the current resistor, any additional high-current carrying impedance causes significant measurement errors.

Place the power-supply bypass capacitor as close as possible to the supply and ground pins. TI recommends a bypass capacitor with a value of 0.1 uF. Add additional decoupling capacitance to compensate for noisy or high-impedance power supplies.