SBAS738A June   2018  – October 2018 ISO224

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics
    10. 7.10 Switching Characteristics
    11. 7.11 Insulation Characteristics Curves
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
      2. 8.3.2 Input Clamp Protection Circuit
      3. 8.3.3 Isolation Channel Signal Transmission
      4. 8.3.4 Fail-Safe Output
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 What to Do and What Not to Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

For best performance, place the 0.22-µF capacitor (C7, as shown in Figure 52) required for decoupling of the internal LDO output as close as possible to the ISO224 VCAP pin. The 0.1-µF ceramic decoupling capacitors for both power supplies (C8 and C9) are located as close as possible to the corresponding VDDx pins followed by the additional 1-µF ceramic capacitors for lower-frequency decoupling (C3 and C12). The resistor and capacitor used for the analog input (R1 and C2) are placed next to the decoupling capacitors. For best performance, use 0603-size or 1206-size, SMD-type, ceramic capacitors with low ESR. Connect the supply voltage sources in a way that allows the supply current to flow through the pads of the decoupling capacitors before powering the device.

Figure 52 shows this approach as implemented on the ISO224EVM. Capacitors C3 and C8 decouple the high-side supply VDD1 and capacitors C9 and C12 are used to support the low-side supply VDD2 of the ISO224.