SLLSFX1 September   2024 ISO6163

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics—5V Supply (±10%)
    10. 5.10 Supply Current Characteristics—5V Supply (±10%)
    11. 5.11 Electrical Characteristics—3.3V Supply (±10%)
    12. 5.12 Supply Current Characteristics—3.3V Supply (±10%)
    13. 5.13 Electrical Characteristics—2.5V Supply (Minimum)
    14. 5.14 Supply Current Characteristics—2.5V Supply  (Minimum)
    15. 5.15 Switching Characteristics—5V Supply (±10%)
    16. 5.16 Switching Characteristics—3.3V Supply (±10%)
    17. 5.17 Switching Characteristics—2.5V Supply (Minimum)
    18. 5.18 Insulation Characteristics Curves
    19. 5.19 Typical Characteristics
      1. 5.19.1 Typical Characteristics: Supply Current ACTIVE state
      2. 5.19.2 Typical Characteristics: High-Speed Channels (ACTIVE state)
      3. 5.19.3 Typical Characteristics: Supply Current STANDBY State
      4. 5.19.4 Typical Characteristics: Low-Speed Control Channels (ACTIVE and STANDBY States)
      5. 5.19.5 Typical Characteristics: Undervoltage Threshold
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Functional Block Diagram
      2. 7.1.2 Feature Description
    2. 7.2 High-Speed Data Channels: A, B, E and F
    3. 7.3 Low-Speed Control Channels With Automatic Enable: C and D
      1. 7.3.1 Low-Speed Control Channels: Timing and Level Details for Automatic Enable
      2. 7.3.2 Low-Speed Control Channels: Considerations if Used for Data
      3. 7.3.3 Low-Speed Control Channels: Considerations During Power Up and Device Reset Events
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)

5.4 Thermal Information

THERMAL METRIC(1) ISO616x UNIT
DW (SOIC)
16 PINS
RθJA Junction-to-ambient thermal resistance 61.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 28.9 °C/W
RθJB Junction-to-board thermal resistance 27.8 °C/W
ψJT Junction-to-top characterization parameter 9.1 °C/W
ψJB Junction-to-board characterization parameter 27.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.