SLLSFX1 September   2024 ISO6163

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics—5V Supply (±10%)
    10. 5.10 Supply Current Characteristics—5V Supply (±10%)
    11. 5.11 Electrical Characteristics—3.3V Supply (±10%)
    12. 5.12 Supply Current Characteristics—3.3V Supply (±10%)
    13. 5.13 Electrical Characteristics—2.5V Supply (Minimum)
    14. 5.14 Supply Current Characteristics—2.5V Supply  (Minimum)
    15. 5.15 Switching Characteristics—5V Supply (±10%)
    16. 5.16 Switching Characteristics—3.3V Supply (±10%)
    17. 5.17 Switching Characteristics—2.5V Supply (Minimum)
    18. 5.18 Insulation Characteristics Curves
    19. 5.19 Typical Characteristics
      1. 5.19.1 Typical Characteristics: Supply Current ACTIVE state
      2. 5.19.2 Typical Characteristics: High-Speed Channels (ACTIVE state)
      3. 5.19.3 Typical Characteristics: Supply Current STANDBY State
      4. 5.19.4 Typical Characteristics: Low-Speed Control Channels (ACTIVE and STANDBY States)
      5. 5.19.5 Typical Characteristics: Undervoltage Threshold
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Functional Block Diagram
      2. 7.1.2 Feature Description
    2. 7.2 High-Speed Data Channels: A, B, E and F
    3. 7.3 Low-Speed Control Channels With Automatic Enable: C and D
      1. 7.3.1 Low-Speed Control Channels: Timing and Level Details for Automatic Enable
      2. 7.3.2 Low-Speed Control Channels: Considerations if Used for Data
      3. 7.3.3 Low-Speed Control Channels: Considerations During Power Up and Device Reset Events
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)

5.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DW-16 PACKAGE
IS Safety input, output, or supply current RθJA =61.5°C/W, VI = 5.5V, TJ = 150°C, TA = 25°C 369 mA
RθJA = 61.5°C/W, VI = 3.6V, TJ = 150°C, TA = 25°C 564
RθJA = 61.5°C/W, VI = 2.75V, TJ = 150°C, TA = 25°C 739
PS Safety input, output, or total power RθJA = 61.5°C/W, TJ = 150°C, TA = 25°C 2032 mW
TS Maximum safety temperature 150 °C
(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS must not be exceeded. These limits vary with the ambient temperature, TA. 

The junction-to-air thermal resistance, RθJA, in the table is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:
TJ = TA + RθJA × P, where P is the power dissipated in the device.
TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.
PS = IS × VI, where VI is the maximum input voltage.