SLLSFF5H January   2020  – May 2022 ISO6720-Q1 , ISO6721-Q1 , ISO6721R-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6.     Insulation Specifications
    7. 7.6  Safety-Related Certifications
    8. 7.7  Safety Limiting Values
    9.     Electrical Characteristics—5-V Supply
    10. 7.8  Supply Current Characteristics—5-V Supply
    11. 7.9  Electrical Characteristics—3.3-V Supply
    12. 7.10 Supply Current Characteristics—3.3-V Supply
    13. 7.11 Electrical Characteristics—2.5-V Supply 
    14. 7.12 Supply Current Characteristics—2.5-V Supply
    15.     Electrical Characteristics—1.8-V Supply
    16. 7.13 Supply Current Characteristics—1.8-V Supply
    17. 7.14 Switching Characteristics—5-V Supply
    18. 7.15 Switching Characteristics—3.3-V Supply
    19. 7.16 Switching Characteristics—2.5-V Supply
    20. 7.17 Switching Characteristics—1.8-V Supply
    21. 7.18 Insulation Characteristics Curves
    22. 7.19 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
    3. 10.3 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
    2. 14.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Description (continued)

Used in conjunction with isolated power supplies, these devices help prevent noise currents on data buses, such as CAN and LIN from damaging sensitive circuitry. Through innovative chip design and layout techniques, the electromagnetic compatibility of the ISO672x-Q1 devices has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO672x-Q1 family of devices is available in a 8-pin SOIC wide-body (DWV) package and 8-pin SOIC narrow-body (D) package and is a pin-to-pin upgrade to the older generations.