SLLSFF5H January   2020  – May 2022 ISO6720-Q1 , ISO6721-Q1 , ISO6721R-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6.     Insulation Specifications
    7. 7.6  Safety-Related Certifications
    8. 7.7  Safety Limiting Values
    9.     Electrical Characteristics—5-V Supply
    10. 7.8  Supply Current Characteristics—5-V Supply
    11. 7.9  Electrical Characteristics—3.3-V Supply
    12. 7.10 Supply Current Characteristics—3.3-V Supply
    13. 7.11 Electrical Characteristics—2.5-V Supply 
    14. 7.12 Supply Current Characteristics—2.5-V Supply
    15.     Electrical Characteristics—1.8-V Supply
    16. 7.13 Supply Current Characteristics—1.8-V Supply
    17. 7.14 Switching Characteristics—5-V Supply
    18. 7.15 Switching Characteristics—3.3-V Supply
    19. 7.16 Switching Characteristics—2.5-V Supply
    20. 7.17 Switching Characteristics—1.8-V Supply
    21. 7.18 Insulation Characteristics Curves
    22. 7.19 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
    3. 10.3 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
    2. 14.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14.1 Package Option Addendum

Packaging Information

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball Finish(6) MSL Peak Temp(3) Op Temp (°C) Device Marking(4)(5)

ISO6720QDWVRQ1

ACTIVE

SOIC

DWV

8

1000

 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 6720

ISO6720FQDWVRQ1

ACTIVE

SOIC

DWV

8

1000

 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 6720F

ISO6721QDWVRQ1

ACTIVE

SOIC

DWV

8

1000

 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 6721

ISO6721FQDWVRQ1

ACTIVE

SOIC

DWV

8

1000

 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 6721F
ISO6720BQDRQ1

ACTIVE

SOIC

D

8

3000

 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 6720B
ISO6720FBQDRQ1

ACTIVE

SOIC

D

8

 3000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 6720FB
ISO6721BQDRQ1

ACTIVE

SOIC

D

8

3000

 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 6721B
ISO6721FBQDRQ1

ACTIVE

SOIC

D

8

 3000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 6721FB
ISO6721RBQDRQ1

ACTIVE

SOIC

D

8

 3000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 21RB
ISO6721RFBQDRQ

ACTIVE

SOIC

D

8

 3000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 21RFB