SLLSFA0C July   2019  – May 2024 ISO7021

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1.     Pin Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics 5V Supply
    10. 6.10 Supply Current Characteristics 5V Supply
    11. 6.11 Electrical Characteristics 3.3V Supply
    12. 6.12 Supply Current Characteristics 3.3V Supply
    13. 6.13 Electrical Characteristics 2.5V Supply
    14. 6.14 Supply Current Characteristics 2.5V Supply
    15. 6.15 Electrical Characteristics 1.8V Supply
    16. 6.16 Supply Current Characteristics 1.8V Supply
    17. 6.17 Switching Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Refresh
      2. 8.3.2 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Insulation Lifetime
      2. 9.1.2 Intrinsic Safety
        1. 9.1.2.1 Schedule of Limitations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.2.1 Schedule of Limitations

These components are certified to comply with IEC 60079-0, Edition 7, IEC 60079-11, Edition 6, EN IEC60079-0:2018 and EN 60070-11:2012. When one of these components is used in an equipment, the component is to be soldered on a PCB inside a suitable enclosure and re-evaluated as an equipment. The operating temperature range of these components is -55°C to 85°C. The creepage and clearance distances across the isolating component have been evaluated, but the distance to other circuitry remain the responsibility of the user of the final equipment.

This assembly is an isolating component between separate intrinsically safe circuits. The assembly must be connected to suitably certified intrinsically safe circuits considering the entity parameters and temperature ratings in the application scenario shown in Table 9-1.

Table 9-1 Entity Parameters and Temperature Ratings
APPLICATION ENTITY PARAMETERS SIDE 1 ENTITY PARAMETERS SIDE 2 AMBIENT TEMPERATURE RANGE MAXIMUM COMPONENT TEMPERATURE
IS to IS Ui = 50V Ui = 50V -55°C to 85°C 183°C
Ii = 300mA Ii = 300mA
Pi = 1.0W Pi = 1.0W
Li = 0H Li = 0H
Ci = 4pF Ci = 4pF