SLLSFA0C July   2019  – May 2024 ISO7021

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1.     Pin Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics 5V Supply
    10. 6.10 Supply Current Characteristics 5V Supply
    11. 6.11 Electrical Characteristics 3.3V Supply
    12. 6.12 Supply Current Characteristics 3.3V Supply
    13. 6.13 Electrical Characteristics 2.5V Supply
    14. 6.14 Supply Current Characteristics 2.5V Supply
    15. 6.15 Electrical Characteristics 1.8V Supply
    16. 6.16 Supply Current Characteristics 1.8V Supply
    17. 6.17 Switching Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Refresh
      2. 8.3.2 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Insulation Lifetime
      2. 9.1.2 Intrinsic Safety
        1. 9.1.2.1 Schedule of Limitations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Ultra-low power consumption
    • 4.8μA per channel quiescent current (3.3V)
    • 15μA per channel at 100kbps (3.3V)
    • 120μA per channel at 1Mbps (3.3V)
  • Robust isolation barrier
    • >100-year projected lifetime
    • 3000VRMS isolation rating
    • ±100kV/μs typical CMTI
  • Wide supply range: 1.71V to 1.89V and 2.25V to 5.5V
  • Wide temperature range: –55°C to 125°C
  • Small 8-SOIC package (8-D)
  • Signaling rate: Up to 4Mbps
  • Default output High (ISO7021) and Low (ISO7021F) options
  • Robust electromagnetic compatibility (EMC)
    • System-level ESD, EFT, and surge immunity
    • ±8kV IEC 61000-4-2 contact discharge protection across isolation barrier
    • Very low emissions
  • Safety-related certifications:
    • DIN EN IEC 60747-17 (VDE 0884-17)
    • UL 1577 Component Recognition Program
    • IEC 62368-1, IEC 61010-1 and GB 4943.1
    • IECEx (IEC 60079-0 & IEC 60079-11) and ATEX (EN IEC60079-0 & EN 60079-11)