SLLSEI6G September   2014  – January 2017 ISO7340C , ISO7340FC , ISO7341C , ISO7341FC , ISO7342C , ISO7342FC

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—5-V Supply
    10. 7.10 Supply Current Characteristics—5-V Supply
    11. 7.11 Electrical Characteristics—3.3-V Supply
    12. 7.12 Supply Current Characteristics—3.3-V Supply
    13. 7.13 Switching Characteristics—5-V Supply
    14. 7.14 Switching Characteristics—3.3-V Supply
    15. 7.15 Insulation Characteristics Curves
    16. 7.16 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Isolated Data Acquisition System for Process Control
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Typical Supply Current Equations
            1. 10.2.1.2.1.1 ISO7340x
            2. 10.2.1.2.1.2 ISO7341x
            3. 10.2.1.2.1.3 ISO7342x
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Typical Application for Module With 16 Inputs
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
      3. 10.2.3 Typical Application for RS-232 Interface
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resource
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

See (1)
MIN MAX UNIT
VCC Supply voltage(2) VCC1, VCC2 –0.5 6 V
Voltage INx, OUTx, ENx –0.5 VCC + 0.5(3) V
IO Output current ±15 mA
TJ Maximum junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak voltage values.
(3) Maximum voltage must not exceed 6 V.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VCC1, VCC2 Supply voltage 3 5.5 V
IOH High-level output current –4 mA
IOL Low-level output current 4 mA
VIH High-level input voltage 2 5.5 V
VIL Low-level input voltage 0 0.8 V
tui Input pulse duration 40 ns
1 / tui Signaling rate 0 25 Mbps
TJ Junction temperature(1) 136 °C
TA Ambient temperature –40 25 125 °C
(1) To maintain the recommended operating conditions for TJ, see the Thermal Information table.

7.4 Thermal Information

THERMAL METRIC(1) ISO734x UNIT
DW (SOIC)
16 PINS
RθJA Junction-to-ambient thermal resistance 78.4 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 41 °C/W
RθJB Junction-to-board thermal resistance 43 °C/W
ψJT Junction-to-top characterization parameter 15.6 °C/W
ψJB Junction-to-board characterization parameter 42.5 °C/W
RθJC(bottom) Junction-to-case(bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.5 Power Ratings

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 12.5-MHz 50% duty cycle square wave
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PD Maximum power dissipation by both sides of ISO7340x 92 mW
PD1 Maximum power dissipation by side-1 of ISO7340x 24
PD2 Maximum power dissipation by side-2 of ISO7340x 68
PD Maximum power dissipation by both sides of ISO7341x 102 mW
PD1 Maximum power dissipation by side-1 of ISO7341x 42
PD2 Maximum power dissipation by side-2 of ISO7341x 60
PD Maximum power dissipation by both sides of ISO7342x 111 mW
PD1 Maximum power dissipation by side-1 of ISO7342x 55.5
PD2 Maximum power dissipation by side-2 of ISO7342x 55.5

7.6 Insulation Specifications

PARAMETER TEST CONDITIONS VALUE UNIT
GENERAL
CLR External clearance(1) Shortest terminal-to-terminal distance through air >8 mm
CPG External creepage(1) Shortest terminal-to-terminal distance across the package surface >8 mm
DTI Distance through the insulation Minimum internal gap (internal clearance) >13 µm
CTI Comparative tracking index DIN EN 60112 (VDE 0303-11); IEC 60112 >400 V
Material group II
Overvoltage Category Rated mains voltage ≤ 300 VRMS I–IV
Rated mains voltage ≤ 600 VRMS I–III
Rated mains voltage ≤ 1000 VRMS I-II
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12(2)
VIORM Maximum repetitive peak isolation voltage AC voltage (bipolar) 1414 VPK
VIOTM Maximum transient isolation voltage VTEST = VIOTM;
t = 60 s (qualification); t = 1 s (100% production)		 4242 VPK
VIOSM Maximum surge isolation voltage(3) Test method per IEC 60065, 1.2/50 µs waveform,
VTEST = 1.3 × VIOSM = 7800 VPK (qualification)		 6000 VPK
qpd Apparent charge(4) Method a: After I/O safety test subgroup 2/3,
Vini = VIOTM, tini = 60 s;
Vpd(m) = 1.2 × VIORM = 1697 VPK, tm = 10 s		 ≤5 pC
Method a: After environmental tests subgroup 1,
Vini = VIOTM, tini = 60 s;
Vpd(m) = 1.6 × VIORM = 2262 VPK, tm = 10 s		 ≤5
Method b1: At routine test (100% production) and preconditioning (type test) Vini = VIOTM, tini = 1 s;
Vpd(m) = 1.875 × VIORM = 2651 VPK, tm = 1 s (100% production)		 ≤5
CIO Barrier capacitance, input to output(5) VIO = 0.4 sin (2πft), f = 1 MHz 2.4 pF
RIO Isolation resistance, input to output(5) VIO = 500 V, TA = 25°C >1012 Ω
VIO = 500 V, 100°C ≤ TA ≤ x°C >1011
VIO = 500 V at TS = 150°C >109
Pollution degree 2
Climatic category 40/125/21
UL 1577
VISO Withstand isolation voltage VTEST = VISO = 3000 VRMS, t = 60 s (qualification); VTEST = 1.2 × VISO = 3600 VRMS, t = 1 s (100% production) 3000 VRMS
(1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance. Creepage and clearance on a printed-circuit board become equal in certain cases. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications.
(2) This coupler is suitable for safe electrical insulation only within the maximum operating ratings. Compliance with the safety ratings shall be ensured by means of suitable protective circuits.
(3) Testing is carried out in air or oil to determine the intrinsic surge immunity of the isolation barrier.
(4) Apparent charge is electrical discharge caused by a partial discharge (pd).
(5) All pins on each side of the barrier tied together creating a two-terminal device

7.7 Safety-Related Certifications

VDE CSA UL CQC
Certified according to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 and DIN EN 61010-1 (VDE 0411-1):2011-07 Approved under CSA Component Acceptance Notice 5A, IEC 60950-1, and IEC 61010-1 Recognized under UL 1577 Component Recognition Program Certified according to GB4943.1-2011
Basic Insulation;
Maximum Transient Overvoltage, 4242 VPK;
Maximum Surge Isolation Voltage, 6000 VPK;
Maximum Repetitive Peak Isolation Voltage, 1414 VPK 		800 VRMS Basic Insulation and 400 VRMS Reinforced Insulation working voltage per CSA 60950-1-07+A1+A2 and IEC 60950-1 2nd Ed.+A1+A2;
300 VRMS Basic Insulation working voltage per CSA 61010-1-12 and IEC 61010-1 3rd Ed.

Single protection, 3000 VRMS
Reinforced Insulation, Altitude ≤ 5000 m, Tropical Climate, 250 VRMS maximum working voltage
Certificate number: 40016131 Master contract number: 220991 File number: E181974 Certificate number: CQC15001121716

7.8 Safety Limiting Values

Safety limiting intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IS Safety input, output, or supply current RθJA = 78.4 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 1 290 mA
RθJA = 78.4 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 1 443
TS Safety temperature 150

The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.

7.9 Electrical Characteristics—5-V Supply

VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = –4 mA; see Figure 14 VCCO(1) – 0.5 4.7 V
IOH = –20 μA; see Figure 14 VCCO(1) – 0.1 5
VOL Low-level output voltage IOL = 4 mA; see Figure 14 0.2 0.4 V
IOL = 20 μA; see Figure 14 0 0.1
VI(HYS) Input threshold voltage hysteresis 480 mV
IIH High-level input current VIH = VCC at INx or ENx 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx –10 μA
CMTI Common-mode transient immunity VI = VCC or 0 V; see Figure 17 25 70 kV/μs
CI Input capacitance(2) VI = VCC/2 + 0.4 sin (2πft), f = 1 MHz, VCC = 5 V 3.4 pF
(1) VCCO is supply voltage, VCC1 or VCC2, for the output channel being measured.
(2) Measured from input pin to ground.

7.10 Supply Current Characteristics—5-V Supply

All inputs switching with square wave clock signal for dynamic ICC measurement. VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS SUPPLY CURRENT MIN TYP MAX UNIT
ISO7340x
Supply current EN = 0 V Disable ICC1 0.6 1.4 mA
ICC2 0.4 0.8
DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 DC to 1 Mbps ICC1 0.6 1.4
ICC2 3.2 4.8
10 Mbps ICC1 1.4 2.3
ICC2 5.6 7.1
25 Mbps ICC1 2.7 4
ICC2 9.3 12
ISO7341x
Supply current EN1 = EN2 = 0 V Disable ICC1 0.8 1.8 mA
ICC2 0.7 1.3
DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 DC to 1 Mbps ICC1 2 3.2
ICC2 2.9 4.4
10 Mbps ICC1 3.2 4.5
ICC2 4.9 6.5
25 Mbps ICC1 5 7
ICC2 7.8 11
ISO7342x
Supply current EN1 = EN2 = 0 V Disable ICC1, ICC2 0.7 1.6 mA
DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 DC to 1 Mbps ICC1, ICC2 2.5 4
10 Mbps ICC1, ICC2 4.1 5.6
25 Mbps ICC1, ICC2 6.4 9

7.11 Electrical Characteristics—3.3-V Supply

VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = –4 mA; see Figure 14 VCCO(1) – 0.5 3 V
IOH = –20 μA; see Figure 14 VCCO(1) – 0.1 3.3
VOL Low-level output voltage IOL = 4 mA; see Figure 14 0.2 0.4 V
IOL = 20 μA; see Figure 14 0 0.1
VI(HYS) Input threshold voltage hysteresis 450 mV
IIH High-level input current VIH = VCC at INx or ENx 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx –10 μA
CMTI Common-mode transient immunity VI = VCC or 0 V; see Figure 17 25 50 kV/μs
(1) VCCO is supply voltage, VCC1 or VCC2, for the output channel being measured.

7.12 Supply Current Characteristics—3.3-V Supply

All inputs switching with square wave clock signal for dynamic ICC measurement. VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS SUPPLY CURRENT MIN TYP MAX UNIT
ISO7340x
Supply current EN = 0 V Disable ICC1 0.4 0.7 mA
ICC2 0.3 0.6
DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 DC to 1 Mbps ICC1 0.4 0.7
ICC2 2.3 3.6
10 Mbps ICC1 0.9 1.3
ICC2 3.9 5.1
25 Mbps ICC1 1.6 2.4
ICC2 6.3 8
ISO7341x
Supply current EN1 = EN2 = 0 V Disable ICC1 0.6 1 mA
ICC2 0.5 0.8
DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 DC to 1 Mbps ICC1 1.4 2.3
ICC2 2.2 3.2
10 Mbps ICC1 2.2 3
ICC2 3.4 4.5
25 Mbps ICC1 3.3 4.7
ICC2 5.2 7.2
ISO7342x
Supply current EN1 = EN2 = 0 V Disable ICC1, ICC2 0.5 0.9 mA
DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 DC to 1 Mbps ICC1, ICC2 1.8 2.8
10 Mbps ICC1, ICC2 2.8 4
25 Mbps ICC1, ICC2 4.3 5.8

7.13 Switching Characteristics—5-V Supply

VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time See Figure 14 20 31 58 ns
PWD(1) Pulse width distortion |tPHL – tPLH| 4 ns
tsk(o)(2) Channel-to-channel output skew time Same-direction Channels 2.5 ns
Opposite-direction Channels 17 ns
tsk(pp)(3) Part-to-part skew time 23 ns
tr Output signal rise time See Figure 14 2.1 ns
tf Output signal fall time 1.7 ns
tPHZ Disable propagation delay, high-to-high impedance output See Figure 15 7 13 ns
tPLZ Disable propagation delay, low-to-high impedance output 7 13 ns
tPZH Enable propagation delay, high impedance-to-high output ISO734xC 7 13 ns
ISO734xFC 15000 23000(4)
tPZL Enable propagation delay, high impedance-to-low output ISO734xC 15000 23000(4) ns
ISO734xFC 7 13
tfs Fail-safe output delay time from input power loss See Figure 16 9.4 μs
(1) Also known as Pulse Skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.
(4) The enable signal rate should be ≤ 43 Kbps.

7.14 Switching Characteristics—3.3-V Supply

VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time See Figure 14 22 35 66 ns
PWD(1) Pulse width distortion |tPHL – tPLH| 2.5
tsk(o) (2) Channel-to-channel output skew time Same-direction Channels 3
Opposite-direction Channels 16
tsk(pp) (3) Part-to-part skew time 28
tr Output signal rise time See Figure 14 2.8 ns
tf Output signal fall time 2.1
tPHZ Disable propagation delay, high-to-high impedance output See Figure 15 9 18 ns
tPLZ Disable propagation delay, low-to-high impedance output 9 18
tPZH Enable propagation delay, high impedance-to-high output ISO734xC 9 18
ISO734xFC 16000 24000(4)
tPZL Enable propagation delay, high impedance-to-low output ISO734xC 16000 24000(4)
ISO734xFC 9 18
tfs Fail-safe output delay time from input power loss See Figure 16 9.4 μs
(1) Also known as Pulse Skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.
(4) The enable signal rate should be ≤ 45 Kbps.

7.15 Insulation Characteristics Curves

ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC D009_SLLSEI6.gif
Figure 1. Thermal Derating Curve for Limiting Current per VDE

7.16 Typical Characteristics

ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC D012_SLLSEI6.gif
TA = 25°C CL = 15 pF
Figure 2. ISO7340x Supply Current vs Data Rate
(15-pF Load)
ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC D010_SLLSEI6.gif
TA = 25°C CL = 15 pF
Figure 4. ISO7341x Supply Current vs Data Rate
(15-pF Load)
ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC D001_SLLSEI6.gif
TA = 25°C CL = 15 pF
Figure 6. ISO7342x Supply Current vs Data Rate
(15-pF Load)
ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC D003_SLLSEI6.gif
TA = 25°C
Figure 8. High-Level Output Voltage vs High-level Output Current
ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC D005_SLLSEI6.gif
Figure 10. Power Supply Undervoltage Threshold vs Free-Air Temperature
ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC D007_SLLSEI6.gif
Figure 12. Input Glitch Suppression Time vs Free-Air Temperature
ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC D013_SLLSEI6.gif
TA = 25°C CL = No Load
Figure 3. ISO7340x Supply Current vs Data Rate
(No Load)
ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC D011_SLLSEI6.gif
TA = 25°C CL = No Load
Figure 5. ISO7341x Supply Current vs Data Rate
(No Load)
ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC D002_SLLSEI6.gif
TA = 25°C CL = No Load
Figure 7. ISO7342x Supply Current vs Data Rate
(No Load)
ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC D004_SLLSEI6.gif
TA = 25°C
Figure 9. Low-Level Output Voltage vs Low-Level Output Current
ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC D006_SLLSEI6.gif
Figure 11. Propagation Delay Time vs Free-Air Temperature
ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC D008_SLLSEI6.gif
TA = 25°C
Figure 13. Output Jitter vs Data Rate