SLLSEC3F September   2012  – April 2016 ISO7631FC , ISO7631FM , ISO7641FC

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: VCC1 and VCC2 at 5 V ± 10%
    6. 6.6  Electrical Characteristics: VCC1 at 5 V ± 10% and VCC2 at 3.3 V ± 10%
    7. 6.7  Electrical Characteristics: VCC1 at 3.3 V ± 10% and VCC2 at 5 V ± 10%
    8. 6.8  Electrical Characteristics: VCC1 and VCC2 at 3.3 V ± 10%
    9. 6.9  Electrical Characteristics: VCC1 and VCC2 at 2.7 V (ISO7631FM Only)
    10. 6.10 Power Dissipation Characteristics
    11. 6.11 Supply Current Characteristics: VCC1 and VCC2 at 5 V ± 10%
    12. 6.12 Supply Current Characteristics: VCC1 at 5 V ± 10% and VCC2 at 3.3 V ± 10%
    13. 6.13 Supply Current Characteristics: VCC1 at 3.3 V ± 10% and VCC2 at 5 V ± 10%
    14. 6.14 Supply Current Characteristics: VCC1 and VCC2 at 3.3 V ± 10%
    15. 6.15 Supply Current Characteristics: VCC1 and VCC2 at 2.7 V (ISO7631FM Only) Only M-Grade devices are recommended for operation down to 2.7 V supplies. For 2.7 V-operation, max data rate is 100 Mbps.
    16. 6.16 Switching Characteristics: VCC1 and VCC2 at 5 V ± 10%
    17. 6.17 Switching Characteristics: VCC1 at 5 V ± 10% and VCC2 at 3.3 V ± 10%
    18. 6.18 Switching Characteristics: VCC1 at 3.3 V ± 10% and VCC2 at 5 V ± 10%
    19. 6.19 Switching Characteristics: VCC1 and VCC2 at 3.3 V ± 10%
    20. 6.20 Switching Characteristics: VCC1 and VCC2 at 2.7 V Only M-Grade devices are recommended for operation down to 2.7 V supplies. For 2.7 V-operation, max data rate is 100 Mbps.
    21. 6.21 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Package Insulation and Safety-Related Specifications IEC and for DW-16 Package from IEC Package Insulation and Safety-Related Specifications for DW-16 Package section.
        1. 8.3.1.1 Safety Limiting Values
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation, see the following:

  • Digital Isolator Design Guide, SLLA284
  • Transformer Driver for Isolated Power Supplies, SLLSEA0
  • Isolation Glossary, SLLA353

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 5. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
ISO7631FM Click here Click here Click here Click here Click here
ISO7631FC Click here Click here Click here Click here Click here
ISO7641FC Click here Click here Click here Click here Click here

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

DeviceNet, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.