SLLSEC3F September   2012  – April 2016 ISO7631FC , ISO7631FM , ISO7641FC

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: VCC1 and VCC2 at 5 V ± 10%
    6. 6.6  Electrical Characteristics: VCC1 at 5 V ± 10% and VCC2 at 3.3 V ± 10%
    7. 6.7  Electrical Characteristics: VCC1 at 3.3 V ± 10% and VCC2 at 5 V ± 10%
    8. 6.8  Electrical Characteristics: VCC1 and VCC2 at 3.3 V ± 10%
    9. 6.9  Electrical Characteristics: VCC1 and VCC2 at 2.7 V (ISO7631FM Only)
    10. 6.10 Power Dissipation Characteristics
    11. 6.11 Supply Current Characteristics: VCC1 and VCC2 at 5 V ± 10%
    12. 6.12 Supply Current Characteristics: VCC1 at 5 V ± 10% and VCC2 at 3.3 V ± 10%
    13. 6.13 Supply Current Characteristics: VCC1 at 3.3 V ± 10% and VCC2 at 5 V ± 10%
    14. 6.14 Supply Current Characteristics: VCC1 and VCC2 at 3.3 V ± 10%
    15. 6.15 Supply Current Characteristics: VCC1 and VCC2 at 2.7 V (ISO7631FM Only) Only M-Grade devices are recommended for operation down to 2.7 V supplies. For 2.7 V-operation, max data rate is 100 Mbps.
    16. 6.16 Switching Characteristics: VCC1 and VCC2 at 5 V ± 10%
    17. 6.17 Switching Characteristics: VCC1 at 5 V ± 10% and VCC2 at 3.3 V ± 10%
    18. 6.18 Switching Characteristics: VCC1 at 3.3 V ± 10% and VCC2 at 5 V ± 10%
    19. 6.19 Switching Characteristics: VCC1 and VCC2 at 3.3 V ± 10%
    20. 6.20 Switching Characteristics: VCC1 and VCC2 at 2.7 V Only M-Grade devices are recommended for operation down to 2.7 V supplies. For 2.7 V-operation, max data rate is 100 Mbps.
    21. 6.21 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Package Insulation and Safety-Related Specifications IEC and for DW-16 Package from IEC Package Insulation and Safety-Related Specifications for DW-16 Package section.
        1. 8.3.1.1 Safety Limiting Values
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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