SLLSEM2H November   2014  – November 2024 ISO7821

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Dissipation Characteristics
    6. 5.6  Electrical Characteristics, 5 V
    7. 5.7  Electrical Characteristics, 3.3 V
    8. 5.8  Electrical Characteristics, 2.5 V
    9. 5.9  Power Ratings
    10. 5.10 Insulation Specifications
    11. 5.11 Safety-Related Certifications
    12. 5.12 Safety Limiting Values
    13. 5.13 Switching Characteristics, 5 V
    14. 5.14 Switching Characteristics, 3.3 V
    15. 5.15 Switching Characteristics, 2.5 V
    16. 5.16 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 8.2.3 Application Performance Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 PCB Material
      2. 8.4.2 Layout Guidelines
      3. 8.4.3 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Documentation
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.12 Safety Limiting Values

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures.

Table 5-5 Safety Limiting
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
ISSafety input, output, or supply current for DW-16 package and DWW-16 PackagesRθJA = 84.7°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C268mA
RθJA = 84.7°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C410
RθJA = 84.7°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C537
PSSafety input, output, or total powerRθJA = 84.7°C/W, TJ = 150°C, TA = 25°C1476mW
TSMaximum safety temperature150°C

The maximum safety temperature is the maximum junction temperature specified for the device. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Section 5.4 is that of a device installed on a High-K test board for Leaded Surface Mount Packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.

ISO7821 ISO7821F Thermal Derating Curve for Safety Limiting Current per VDEFigure 5-1 Thermal Derating Curve for Safety Limiting Current per VDE
ISO7821 ISO7821F Thermal Derating Curve for Safety Limiting Power per VDEFigure 5-2 Thermal Derating Curve for Safety Limiting Power per VDE