SLLSEM2H November   2014  – November 2024 ISO7821

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Dissipation Characteristics
    6. 5.6  Electrical Characteristics, 5 V
    7. 5.7  Electrical Characteristics, 3.3 V
    8. 5.8  Electrical Characteristics, 2.5 V
    9. 5.9  Power Ratings
    10. 5.10 Insulation Specifications
    11. 5.11 Safety-Related Certifications
    12. 5.12 Safety Limiting Values
    13. 5.13 Switching Characteristics, 5 V
    14. 5.14 Switching Characteristics, 3.3 V
    15. 5.15 Switching Characteristics, 2.5 V
    16. 5.16 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 8.2.3 Application Performance Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 PCB Material
      2. 8.4.2 Layout Guidelines
      3. 8.4.3 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Documentation
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The ISO7821 is a high-performance, dual-channel digital isolator with 8000VPK isolation voltage. This device has reinforced isolation certifications according to VDE, CSA, CQC, and TUV. The isolator provides high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by silicon dioxide (SiO2) insulation barrier. ISO7821 has one forward and one reverse-direction channel. If the input power or signal is lost, default output is 'high' for the ISO7821 and 'low' for the ISO7821F device. Used in conjunction with isolated power supplies, this device prevents noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. Through innovative chip design and layout techniques, electromagnetic compatibility of ISO7821 has been significantly enhanced to ease system-level ESD, EFT, Surge and Emissions compliance. ISO7821 is available in 16-pin SOIC wide-body (DW) and extra-wide body (DWW) packages. The DWW package option comes with enable pins which can be used to put the respective outputs in high impedance for multi-controller driving applications and to reduce power consumption.

Package Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM) PACKAGE SIZE(2)
ISO7821,
ISO7821F		 DW (SOIC, 16) 10.30mm × 7.50mm
DWW (Extra wide SOIC, 16) 10.30mm × 14.0mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.

ISO7821 ISO7821F Simplified Schematic
A. VCCI and GNDI are supply and ground connections respectively for the input channels.
B. VCCO and GNDO are supply and ground connections respectively for the output channels.
Simplified Schematic