SLLSEM2H November   2014  – November 2024 ISO7821

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Dissipation Characteristics
    6. 5.6  Electrical Characteristics, 5 V
    7. 5.7  Electrical Characteristics, 3.3 V
    8. 5.8  Electrical Characteristics, 2.5 V
    9. 5.9  Power Ratings
    10. 5.10 Insulation Specifications
    11. 5.11 Safety-Related Certifications
    12. 5.12 Safety Limiting Values
    13. 5.13 Switching Characteristics, 5 V
    14. 5.14 Switching Characteristics, 3.3 V
    15. 5.15 Switching Characteristics, 2.5 V
    16. 5.16 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 8.2.3 Application Performance Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 PCB Material
      2. 8.4.2 Layout Guidelines
      3. 8.4.3 Layout Example
  10. Device and Documentation Support
    1. 9.1 Related Documentation
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Power Supply Recommendations

To provide reliable operation at all data rates and supply voltages, a 0.1 µF bypass capacitor is recommended at input and output supply pins (VCC1 and VCC2). The capacitors must be placed as close to the supply pins as possible. If only a single primary-side power supply is available in an application, isolated power can be generated for the secondary-side with the help of a transformer driver such as Texas Instruments' SN6501. For such applications, detailed power supply design and transformer selection recommendations are available in SN6501 data sheet (SLLSEA0).