SLLSEM2H November   2014  – November 2024 ISO7821

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Dissipation Characteristics
    6. 5.6  Electrical Characteristics, 5 V
    7. 5.7  Electrical Characteristics, 3.3 V
    8. 5.8  Electrical Characteristics, 2.5 V
    9. 5.9  Power Ratings
    10. 5.10 Insulation Specifications
    11. 5.11 Safety-Related Certifications
    12. 5.12 Safety Limiting Values
    13. 5.13 Switching Characteristics, 5 V
    14. 5.14 Switching Characteristics, 3.3 V
    15. 5.15 Switching Characteristics, 2.5 V
    16. 5.16 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 8.2.3 Application Performance Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 PCB Material
      2. 8.4.2 Layout Guidelines
      3. 8.4.3 Layout Example
  10. Device and Documentation Support
    1. 9.1 Related Documentation
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics, 3.3 V

VCC1 = VCC2 = 3.3 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VOHHigh-level output voltageIOH = –2 mA; see Figure 6-1VCCO(1) – 0.4VCCO – 0.2V
VOLLow-level output voltageIOL = 2 mA; see Figure 6-10.20.4V
VI(HYS)Input threshold voltage hysteresis0.1 x VCCOV
IIHHigh-level input currentVIH = VCCI(1) at INx or ENx10μA
IILLow-level input currentVIL = 0 V at INx or ENx-10
CMTICommon-mode transient immunityVI = VCCI or 0 V; see Figure 6-4100kV/μs
Supply Current - ISO7821DW and ISO7821FDW
ICC1, ICC2DC SignalVI = 0 V (ISO7821F) , VI = VCCI(1)(ISO7821)1.21.7mA
ICC1, ICC2DC SignalVI = VCCI(1) (ISO7821F) , VI = 0 V (ISO7821)2.43.4mA
ICC1, ICC21 MbpsAll channels switching with square wave clock input; CL = 15 pF1.82.6mA
ICC1, ICC210 Mbps2.23mA
ICC1, ICC2100 Mbps5.87.1mA
Supply Current - ISO7821DWW and ISO7821FDWW
ICC1, ICC2DisableEN1 = EN2 = 0V, VI = 0 V (ISO7821F) , VI = VCCI(1)(ISO7821)0.71.1mA
ICC1, ICC2DisableEN1 = EN2 = 0V, VI = VCCI(1) (ISO7821F) , VI = 0 V (ISO7821)1.82.9mA
ICC1, ICC2DC SignalVI = 0 V (ISO7821F) , VI = VCCI(1)(ISO7821)1.21.7mA
ICC1, ICC2DC SignalVI = VCCI(1) (ISO7821F) , VI = 0 V (ISO7821)2.43.5mA
ICC1, ICC21 MbpsAll channels switching with square wave clock input; CL = 15 pF1.92.6mA
ICC1, ICC210 Mbps2.33mA
ICC1, ICC2100 Mbps5.97.1mA
VCCI = Input-side VCC; VCCO = Output-side VCC.