SLLSEM2H November   2014  – November 2024 ISO7821

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Dissipation Characteristics
    6. 5.6  Electrical Characteristics, 5 V
    7. 5.7  Electrical Characteristics, 3.3 V
    8. 5.8  Electrical Characteristics, 2.5 V
    9. 5.9  Power Ratings
    10. 5.10 Insulation Specifications
    11. 5.11 Safety-Related Certifications
    12. 5.12 Safety Limiting Values
    13. 5.13 Switching Characteristics, 5 V
    14. 5.14 Switching Characteristics, 3.3 V
    15. 5.15 Switching Characteristics, 2.5 V
    16. 5.16 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 8.2.3 Application Performance Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 PCB Material
      2. 8.4.2 Layout Guidelines
      3. 8.4.3 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Documentation
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

ISO7821 ISO7821F DW Package16-Pin (SOIC)Top View Figure 4-1 DW Package16-Pin (SOIC)Top View
ISO7821 ISO7821F DWW Package16-Pin (SOIC)Top View Figure 4-2 DWW Package16-Pin (SOIC)Top View
Table 4-1 Pin Functions
PIN Type DESCRIPTION
NAME NO. NO.
DW DWW
GND1 1, 7 2,8 – Ground connection for VCC1
GND2 9, 16 9,15 – Ground connection for VCC2
INA 13 12 I Input, channel A
INB 5 6 I Input, channel B
NC 2, 6, 8, 10 ,11, 15 3,7,10,14 – Not connected
OUTA 4 5 O Output, channel A
OUTB 12 11 O Output, channel B
VCC1 3 1 – Power supply, VCC1
VCC2 14 16 – Power supply, VCC2
EN1 – 4 I Output enable 1. Output pins on side 1 are enabled when EN1 is high or open and in high-impedance state when EN1 is low.
EN2 – 13 I Output enable 2. Output pins on side 2 are enabled when EN2 is high or open and in high-impedance state when EN2 is low.