SLLSEM2H November   2014  – November 2024 ISO7821

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Dissipation Characteristics
    6. 5.6  Electrical Characteristics, 5 V
    7. 5.7  Electrical Characteristics, 3.3 V
    8. 5.8  Electrical Characteristics, 2.5 V
    9. 5.9  Power Ratings
    10. 5.10 Insulation Specifications
    11. 5.11 Safety-Related Certifications
    12. 5.12 Safety Limiting Values
    13. 5.13 Switching Characteristics, 5 V
    14. 5.14 Switching Characteristics, 3.3 V
    15. 5.15 Switching Characteristics, 2.5 V
    16. 5.16 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 8.2.3 Application Performance Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 PCB Material
      2. 8.4.2 Layout Guidelines
      3. 8.4.3 Layout Example
  10. Device and Documentation Support
    1. 9.1 Related Documentation
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision G (July 2022) to Revision H (November 2024)

  • Go
  • Added content from the High Voltage Feature Description section to the Specifications sectionGo
  • Moved the IEC 60664-1 Ratings table to the Power Ratings section in the Specifications Go
  • Added typical specification to CPG/CLR in the Insulation Specifications section Go
  • Moved the Insulation Characteristics table to the Insulation Specifications sectionGo
  • Moved the Package Insulation and Safety-Related Specification table to the Insulation Specifications sectionGo
  • Changed the Regulatory Information Section to the Safety-related Certifications section and moved to the Specifications sectionGo
  • Moved the Safety Limiting Values to the Specifications sectionGo

Changes from Revision F (March 2016) to Revision G (July 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the document. Go

Changes from Revision E (December 2015) to Revision F (March 2016)

  • Changed the Safety and Regulatory Approvals list of Section 1 Go
  • Added Section 1 "TUV Certification per EN 61010-1 and EN 60950-1" Go
  • Changed text in the first paragraph of the Section 3 From: "certifications according to VDE, CSA, and CQC". To: "certifications according to VDE, CSA, CQC, and TUV." Go
  • Added Note 1 to Table 5-2 Go
  • Added TUV to the Section 5.11 section and Table 5-4. Deleted Note 1 in Table 4 Go
  • Changed Figure 7-3 Go

Changes from Revision D (July 2015) to Revision E (December 2015)

  • Changed Section 1 From: 8000VPK VIOTM and 2121 VPK VIORM Reinforced..To: 8000VPK Reinforced...Go
  • Added Section 1: DW Package Certifications Complete; DWW Certifications Planned Go
  • Added text to the Description: and extra-wide body (DWW) packages...Go
  • Added package: Extra wide SOIC, DWW (16) to the Device Information table Go
  • Added the DWW pinout image Go
  • Added the DWW package to the Section 5.4 Go
  • Changed the MIN value of CMTI in Section 5.6 table From: 70 To: 100 kV/µs, deleted the TYP value of 100 kV/µs Go
  • Added the DW package value to the Supply Current section of the Section 5.6 Go
  • Added the DWW package value to the Supply Current section of the Section 5.6 Go
  • Changed the MIN value of CMTI in Section 5.7 table From: 70 To: 100 kV/µs, deleted the TYP value of 100 kV/µs Go
  • Added the DW package value to the Supply Current section of the Section 5.7 Go
  • Added the DWW package value to the Supply Current section of the Section 5.7 Go
  • Changed the MIN value of CMTI in Section 5.8 table From: 70 To: 100 kV/µs, deleted the TYP value of 100 kV/µs Go
  • Added the DW package value to the Supply Current section of the Section 5.8 Go
  • Added the DWW package value to the Supply Current section of the Section 5.8 Go
  • Changed Parameter information and added the DWW package information in Table 5-1 Go
  • Added the DWW package to Table 5-3 Go
  • Changed CIO typ value From: 2 To 1 pF in Table 5-3 Go
  • Added the DWW package to Table 5-2 Go
  • Added the DWW package information to Table 5-4 Go
  • added DWW-16 package options to Table 5-5 Go
  • Added tPHZ, tPLZ, tPZH, and tPZL to Section 5.14 Go
  • Added tPHZ, tPLZ, tPZH, and tPZL to Section 5.15 Go
  • Added Figure 6-2 Go
  • Changed Table 7-1 Go
  • Added text to the Section 8.1 section: "isolation voltage per UL 1577." Go

Changes from Revision C (May 2015) to Revision D (July 2015)

  • Added device ISO7821F to the data sheet Go
  • Changed the Section 3 to include: "default output is 'high' for the ISO7821 device and 'low' for the ISO7821F device. Go
  • Changed the Figure 3-1 Go
  • Changed Table 5-3 title From: IEC Insulation and Safety-Related Specifications for DW-16 Package To: Package Insulation and Safety-Related Specifications Go
  • Changed Figure 5-1, Added Figure 5-2 Go
  • Changed tPLH and tPHL From: 5.5 V to 5 V in Figure 5-8 Go
  • Changed Figure 6-3 Go
  • Changed the Section 7.2 Go

Changes from Revision B (April 2015) to Revision C (May 2015)

  • Changed From: VCC1 and VCC2 To: VCCI and VCCO, GND1 and GND2 To: GNDI and GNDO and added Notes 1 and 2 in the Figure 3-1 Go
  • Changed the MIN value of CMTI in Section 5.6 table From: 50 To: 70 kV/µs Go
  • Changed the MIN value of CMTI in Section 5.7 table From: 50 To: 70 kV/µs Go
  • Changed the MIN value of CMTI in Section 5.8 table From: 50 To: 70 kV/µs Go
  • Changed the Installation classification of the Table 5-1 to include DW package informationGo
  • Added sentence "If the EN pin is available and low then the output goes to high impedance." to the Section 7.1 section Go
  • Changed the Section 7.2 to include the EN pin on the Receiver sideGo
  • Changed "ISO782W functional modes" To: "ISO7821DW functional modes" in Section 7.4 Go
  • Changed Table 7-1 title From: "Functional Table" To: "ISO7821DW Function Table"Go
  • Added the Section 7.4.1 section Go
  • Changed device number ISO7821 To: ISO7821DW in Figure 8-2 Go

Changes from Revision A (December 2014) to Revision B (April 2015)

Changes from Revision * (November 2014) to Revision A (December 2014)

  • Changed From: A product preview that included only page 1 and the pinout section To: A complete data sheet Go