SLLSFC6D November   2021  – January 2023 ISOUSB111

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Supply Options
      2. 8.3.2 Power Up
      3. 8.3.3 Symmetric Operation, Dual-Role Port and Role-Reversal
      4. 8.3.4 Connect and Speed Detection
      5. 8.3.5 Disconnect Detection
      6. 8.3.6 Reset
      7. 8.3.7 LS/FS Message Traffic
      8. 8.3.8 L2 Power Management State (Suspend) and Resume
      9. 8.3.9 L1 Power Management State (Sleep) and Resume
    4. 8.4 Device Functional Modes
  9. 9 Power Supply Recommendations
  10. 10Application and Implementation
    1. 10.1 Typical Application
      1. 10.1.1 Isolated Host or Hub
      2. 10.1.2 Isolated Peripheral - Self-Powered
      3. 10.1.3 Isolated Peripheral - Bus-Powered
      4. 10.1.4 Application Curve
        1. 10.1.4.1 Insulation Lifetime
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Layout Example
      2. 11.1.2 PCB Material
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1.1 Layout Example

The layout example in this section shows the recommended placement for de-coupling capacitors and ESD protection diodes. A continuous ground plane is recommended below the D+/D- signal traces. Small footprint capacitors (0402/0201) are recommended so that these may be placed very close to the supply pins and corresponding ground pins and connected using the top layer. There should not be any vias in the routing path between the decoupling capacitors and the corresponding supply and ground pins. The ESD protection diodes should be placed close to the connector with a strong connection to the ground plane. The example shown is for an isolated host or hub, but similar considerations apply for isolated peripherals also. The 120-μF capacitor on VBUS only applies to host or hub and should not be used for peripherals. A ferrite bead, with dc resistance less than 100 mΩ, may be optionally placed on the VBUS route, after the 100-nF (and 120-μF) capacitors to prevent transients such as ESD from affecting the rest of the circuits.

For best performance, it is recommended to minimize the length of D+/D- board traces from the MCU to ISOUSB111, and from ISOUSB111 to the connector. Vias and stubs on D+/D- lines must be avoided.

Figure 11-1 Layout Example for ISOUSB111.