SLLSFC6D November   2021  – January 2023 ISOUSB111

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Supply Options
      2. 8.3.2 Power Up
      3. 8.3.3 Symmetric Operation, Dual-Role Port and Role-Reversal
      4. 8.3.4 Connect and Speed Detection
      5. 8.3.5 Disconnect Detection
      6. 8.3.6 Reset
      7. 8.3.7 LS/FS Message Traffic
      8. 8.3.8 L2 Power Management State (Suspend) and Resume
      9. 8.3.9 L1 Power Management State (Sleep) and Resume
    4. 8.4 Device Functional Modes
  9. 9 Power Supply Recommendations
  10. 10Application and Implementation
    1. 10.1 Typical Application
      1. 10.1.1 Isolated Host or Hub
      2. 10.1.2 Isolated Peripheral - Self-Powered
      3. 10.1.3 Isolated Peripheral - Bus-Powered
      4. 10.1.4 Application Curve
        1. 10.1.4.1 Insulation Lifetime
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Layout Example
      2. 11.1.2 PCB Material
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

0.1 µF capacitors are recommended to be placed very close to V3P3Vx pins to GNDx. 1-µF capacitors are recommended to be placed placed very close to VBUSx pins to GNDx.

These decoupling capacitor recommendations are irrespective of whether the 3.3 V supplies are provided externally or generated using internal LDOs.

Refer to the Section 11.1.1 section for recommended placement of the decoupling capacitors. Small footprint capacitors (0402/0201) are recommended so that these may be placed very close to the supply pins and corresponding ground pins on the top layer without the use of vias.

While isolating a host/hub or bus-powered peripherals, isolated power is needed and can be generated with the help of a transformer driver such as TI's SN6505B. For such applications, detailed power supply design, and transformer selection recommendations are available in the SN6505 Low-Noise 1-A Transformer Drivers for Isolated Power Supplies data sheet.