SLLSFC6D November   2021  – January 2023 ISOUSB111

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Supply Options
      2. 8.3.2 Power Up
      3. 8.3.3 Symmetric Operation, Dual-Role Port and Role-Reversal
      4. 8.3.4 Connect and Speed Detection
      5. 8.3.5 Disconnect Detection
      6. 8.3.6 Reset
      7. 8.3.7 LS/FS Message Traffic
      8. 8.3.8 L2 Power Management State (Suspend) and Resume
      9. 8.3.9 L1 Power Management State (Sleep) and Resume
    4. 8.4 Device Functional Modes
  9. 9 Power Supply Recommendations
  10. 10Application and Implementation
    1. 10.1 Typical Application
      1. 10.1.1 Isolated Host or Hub
      2. 10.1.2 Isolated Peripheral - Self-Powered
      3. 10.1.3 Isolated Peripheral - Bus-Powered
      4. 10.1.4 Application Curve
        1. 10.1.4.1 Insulation Lifetime
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Layout Example
      2. 11.1.2 PCB Material
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC1(1) ISOUSB111 UNIT
DW (SOIC) DWX (SSOP)
16 PINS 16 PINS
RΘJA Junction-to-ambient thermal resistance 53.4 60.6 °C/W
RΘJC(top) Junction-to-case (top) thermal resistance 19.6 22.5 °C/W
RΘJB Junction-to-board thermal resistance 22.3 27 °C/W
ψJT Junction-to-top characterization parameter 2.4 2 °C/W
ψJB Junction-to-board characterization parameter 21.6 26.1 °C/W
RΘJC(bot) Junction-to-case (bottom) thermal resistance - - °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.