SNVSBF7 November   2019 LDC1001

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Axial Distance Sensing Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Condition
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Inductive Sensing
      2. 7.3.2 Measuring RP With LDC1001
      3. 7.3.3 Measuring Inductance With LDC1001
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
      2. 7.4.2 INTB Pin Modes
        1. 7.4.2.1 Comparator Mode
        2. 7.4.2.2 Wake-Up Mode
        3. 7.4.2.3 DRDY Mode
    5. 7.5 Programming
      1. 7.5.1 SPI Description
        1. 7.5.1.1 Extended SPI Transactions
    6. 7.6 Register Maps
      1. 7.6.1 Register Description
        1. 7.6.1.1  Revision ID (Address = 0x00)
        2. 7.6.1.2  RP_MAX (Address = 0x01)
        3. 7.6.1.3  RP_MIN (Address = 0x02)
        4. 7.6.1.4  Watchdog Timer Frequency (Address = 0x03)
        5. 7.6.1.5  LDC Configuration (Address = 0x04)
        6. 7.6.1.6  Clock Configuration (Address = 0x05)
        7. 7.6.1.7  Comparator Threshold High LSB (Address = 0x06)
        8. 7.6.1.8  Comparator Threshold High MSB (Address = 0x07)
        9. 7.6.1.9  Comparator Threshold Low LSB (Address = 0x08)
        10. 7.6.1.10 Comparator Threshold Low MSB (Address = 0x09)
        11. 7.6.1.11 INTB Pin Configuration (Address = 0x0A)
        12. 7.6.1.12 Power Configuration (Address = 0x0B)
        13. 7.6.1.13 Status (Address = 0x20)
        14. 7.6.1.14 Proximity Data LSB (Address = 0x21)
        15. 7.6.1.15 Proximity Data MSB (Address = 0x22)
        16. 7.6.1.16 Frequency Counter LSB (Address = 0x23)
        17. 7.6.1.17 Frequency Counter Mid-Byte (Address = 0x24)
        18. 7.6.1.18 Frequency Counter MSB (Address = 0x25)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Calculation of RP_MIN and RP_MAX
        1. 8.1.1.1 RP_MAX
        2. 8.1.1.2 RP_MIN
      2. 8.1.2 Output Data Rate
      3. 8.1.3 Choosing Filter Capacitor (CFA and CFB Pins)
    2. 8.2 Typical Application
      1. 8.2.1 Axial Distance Sensing Using a PCB Sensor With LDC1001
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Sensor and Target
          2. 8.2.1.2.2 Calculating Sensor Capacitor
          3. 8.2.1.2.3 Choosing Filter Capacitor
          4. 8.2.1.2.4 Setting RP_MIN and RP_MAX
          5. 8.2.1.2.5 Calculating Minimum Sensor Frequency
        3. 8.2.1.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

Unless otherwise specified, all limits ensured for TA = TJ = 25°C, VDD = 5 V, VIO = 3.3 V(1)(2)
PARAMETER TEST CONDITIONS MIN(3) TYP(4) MAX(3) UNIT
POWER
VDD Analog supply voltage 4.75 5 5.25 V
VIO IO supply voltage  VIO ≤ VDD 1.8 3.3 5.25 V
IDD Supply current on VDD pin PWR_MODE = 1, no sensor connected 1.7 2.3 mA
IVIO IO supply current Static current 14 µA
IDD_LP Standby mode supply current on VDD pin PWR_MODE = 0, no sensor connected 250 µA
tSTART Start-up time From POR to ready-to-convert. 2 ms
LDC
ƒSENSOR_MIN Minimum sensor frequency 5 kHz
ƒSENSOR_MAX Maximum sensor frequency 5 MHz
ASENSOR_MIN Minimum sensor amplitude 1 VPP
ASENSOR_MAX Maximum sensor amplitude 4 VPP
tREC Recovery time Oscillation start-up time after RP under-range condition 10 1/ƒsensor
RP_MIN Minimum sensor RP range 798 Ω
RP_MAX Maximum sensor RP range 3.93 MΩ
RP_RES RP measurement resolution 16 Bits
L Res Inductance measurement resolution RESPONSE_TIME = b111 (6144), ƒEXT = 8 MHz, ƒSENSOR = 5 kHz 24 Bits
tS_MIN Minimum response time Minimum programmable settling time of digital filter 192/ƒSENSOR s
tS_MAX Maximum response time Maximum programmable settling time of digital filter 6144/ƒSENSOR s
EXTERNAL CLOCK FOR FREQUENCY COUNTER
External Clock Frequency 8 MHz
Clock input high voltage VIO V
DIGITAL I/O CHARACTERISTICS
VIH Logic 1 input voltage 0.8 × VIO V
VIL Logic 0 input voltage 0.2 × VIO V
VOH Logic 1 output voltage ISOURCE = 400 µA VIO–0.3 V
VOL Logic 0 output voltage ISINK = 400 µA 0.3 V
IIOHL Digital IO leakage current –500 500 nA
(1) table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically.
(2) The maximum power dissipation is a function of TJ(MAX), RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PCB. The package thermal impedance is calculated in accordance with JESD 51-7.
(3) Limits are specified by testing, design, or statistical analysis at 25°C. Limits over the operating temperature range are specified through correlations using statistical quality control (SQC) method.
(4) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped production material.